Lithiophilic 3D substrates for lithium metal anodes (LMAs) are attracting considerable attention because they can provide an extensive active surface area and electrolyte reservoir for reversible lithium metal storage. However, the introduction of additional 3D-structured electrode materials on a typical Cu foil substrate decreases the specific/volumetric capacities of LMA. Herein, we report an alternative intagliated Cu foil (I-Cu) substrate with lithiophilic trenches that can be prepared through a mass-scalable photoresist process followed by simple chemical treatments. The patterned trenches are covered with nanocrevices, including numerous oxygen functional groups (O/Cu ratio of 1.00) and nanopores, extensively widening the electrochemical active surface area (EASA) of the I-Cu substrate by > 30 times that of a typical 2D Cu foil. The nanostructure, high surface area, lithiophilic surface properties, and intagliated trenches of the I-Cu substrate serve to guide preferred lithium metal nucleation and growth behavior on the controlled active surfaces. Accordingly, highly efficient and stable cycling performances were accomplished for the LMA composed of the I-Cu substrate over 500 cycles with an average Coulombic efficiency of ∼ 99%. Moreover, the feasibility of the I-Cu-based LMA was demonstrated in the full cell tests with typical cathode materials, NCM622 and a sulfur copolymer.

中文翻译：

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用于锂金属阳极的含有多功能亲锂沟槽的凹雕铜基板

用于锂金属阳极 (LMA) 的亲锂 3D 基底吸引了相当多的关注，因为它们可以为可逆锂金属存储提供广泛的活性表面积和电解质储存库。然而，在典型的铜箔基板上引入额外的 3D 结构电极材料会降低 LMA 的比/体积容量。在此，我们报告了一种具有亲锂沟槽的替代凹版铜箔（I-Cu）基板，可以通过大规模可扩展的光刻胶工艺和简单的化学处理来制备。图案化的沟槽覆盖有纳米缝隙，包括大量的氧官能团（O/Cu 比率为 1.00）和纳米孔，大大拓宽了 I-Cu 基板的电化学活性表面积 (EASA)，是典型 2D Cu 的 30 倍以上挫败。 I-Cu 基底的纳米结构、高表面积、亲锂表面特性和凹刻沟槽有助于引导受控活性表面上优选的锂金属成核和生长行为。因此，由 I-Cu 基板组成的 LMA 实现了超过 500 次循环的高效且稳定的循环性能，平均库仑效率约为 99%。此外，I-Cu基LMA的可行性在典型正极材料NCM622和硫共聚物的全电池测试中得到了证明。