Nano boron nitride-trimethylolpropane tris (3-mercaptopropionate) grafted poly (L-lactic acid) (BN-TTMP-PLLA) was prepared with nonmetallic organic catalyst by thiol-ene click chemistry. By orthogonal experiment and range analysis, the optimum reaction conditions of BN-TTMP-PLLA were as follows: reaction time of 2.5 h, photoinitiator addition amount of 0.04 g, TTMP addition amount of 0.9 g, and mass ratio of PLLA-AA to BN-570 of 1:1. The product was characterized by Fourier transform infrared spectroscopy and X-ray photoelectron spectroscopy, which showed that PLLA was successfully grafted onto BN surface. Furthermore, PLA/BN-TTMP-PLLA nanocomposites were prepared by melt blending with BN-TTMP-PLLA as modifier to enhance the performance of PLA. Compared with pure PLA, the impact strength and elongation at break of PLA/BN-TTMP-PLLA (0.5 wt%) nanocomposites were increased by 1.58 times and 7.34 times, respectively. Molecular dynamics simulation calculation showed that E_Interaction between PLA and BN before and after functionalization decreased from −177.44 kcal/mol to −516.42 kcal/mol, which proved that intermolecular interactions between them were strengthened. In addition, PLA/BN-TTMP-PLLA (0.5 wt%) nanocomposites during melting and isothermal crystallization were studied by Rheonaut technology for simultaneous rheometry and FTIR, which demonstrated that the crystallization properties of PLA was clearly improved due to the strong hydrogen bonding effect between BN-TTMP-PLLA and PLA.

采用硫醇-烯点击化学，在非金属有机催化剂的作用下，制备了纳米氮化硼-三羟甲基丙烷三（3-巯基丙酸酯）接枝聚（L-乳酸）（BN-TTMP-PLLA）。通过正交试验和极差分析，BN-TTMP-PLLA的最佳反应条件为：反应时间2.5h，光引发剂添加量0.04g，TTMP添加量0.9g，PLLA-AA与BN的质量比-570 的 1:1。产物通过傅里叶变换红外光谱和X射线光电子能谱表征，表明PLLA成功接枝到BN表面。此外，PLA/BN-TTMP-PLLA纳米复合材料通过与BN-TTMP-PLLA作为改性剂熔融共混以提高PLA的性能。与纯PLA相比，PLA/BN-TTMP-PLLA的冲击强度和断裂伸长率(0. 5 wt%) 纳米复合材料分别增加了 1.58 倍和 7.34 倍。分子动力学模拟计算表明，E功能化前后PLA和BN的_相互作用从-177.44 kcal/mol降低到-516.42 kcal/mol，证明它们之间的分子间相互作用得到加强。此外，利用 Rheonaut 技术对熔融和等温结晶过程中的 PLA/BN-TTMP-PLLA (0.5 wt%) 纳米复合材料进行了同步流变测量和 FTIR 研究，结果表明 PLA 的结晶性能由于强氢键作用而得到明显改善BN-TTMP-PLLA 和 PLA 之间。