In this article, we propose two kinds of electrical interconnect test methods for production tests and field ones of assembled circuit boards, which are performed prior to and after shipping to market, respectively. For these tests, we also propose a built-in test circuit. The methods we followed are based on the oscillation frequency of a relaxation oscillator (ROsc) embedded in integrated circuits (ICs). The frequency is measured as the number of pulse signals within a specified test time. Using the test methods, open defects at the interconnects between IC pins and a printed circuit board (PCB) are detected that are modeled as a resistor, a capacitor, and an open-circuit fault. We examined the detectability of open defects using the process variations afforded by SPICE simulation. The simulation results show that open defects were detected, modeled as a resistor of 45.8 Ω or above, along with open defects modeled as a capacitor and an open-circuit fault using the production test method. In addition, a resistance increase of 1.2 Ω at defect-free interconnects occurred after shipping to market was detected using the field test method. We also prototyped ICs with embedded ROscs and built an experimental circuit made of the ICs on PCBs. Moreover, we experimentally examined whether open defects could be detected. The results show that with the production test method, open defects modeled as a resistor of 10 Ω or above and modeled as a capacitor and an open-circuit fault can be detected.

中文翻译：

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具有内置张弛振荡器的组装电路板中的开路缺陷检测


在本文中，我们提出了两种用于组装电路板的生产测试和现场测试的电气互连测试方法，分别在上市之前和之后进行。对于这些测试，我们还提出了内置测试电路。我们遵循的方法基于嵌入集成电路 (IC) 中的张弛振荡器 (ROsc) 的振荡频率。频率测量为指定测试时间内脉冲信号的数量。使用这些测试方法，可以检测 IC 引脚和印刷电路板 (PCB) 之间互连处的开路缺陷，这些缺陷被建模为电阻器、电容器和开路故障。我们使用 SPICE 仿真提供的工艺变化检查了开放缺陷的可检测性。仿真结果表明，使用生产测试方法检测到开路缺陷（建模为 45.8 Ω 或以上的电阻器）、开路缺陷（建模为电容器）和开路故障。此外，使用现场测试方法检测到，在上市后，无缺陷互连处的电阻增加了 1.2 Ω。我们还制作了带有嵌入式 ROsc 的 IC 原型，并在 PCB 上构建了由 IC 制成的实验电路。此外，我们通过实验检查是否可以检测到开放缺陷。结果表明，采用生产测试方法，可以检测到10Ω及以上电阻模型的开路缺陷、电容器模型的开路缺陷以及开路故障。