In this article, we propose a new packaging technology enabling the development of a high-performance power module for harsh environments. This approach is based on the use of the selective laser melting (SLM) technique in order to directly print metal heat sinks on the backside of the metallized substrate. In order to explore the viability of this method, the assembled parts were evaluated thoroughly after the manufacturing process. Moreover, their robustness was assessed during aging under harsh conditions. Results show that the ultimate tensile strength and yield strength of the printed alloy are higher than the casted AlSi7Mg0.6 counterpart. The interfaces between the printed alloy and the substrate Al metal layer do not show any weaknesses, and shear stress values are higher than 100 MPa. For all heat sink patterns, the substrate warpage is reduced during thermal cycling due to the Al alloy creeping, while the highly curved substrates show cracks in the ceramic after 400 cycles. Accordingly, direct printing of heat sink with patterns based on fins array reveals a promising path for high-reliability, high-performance power module packaging.

中文翻译：

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高性能功率模块金属化陶瓷基板上直接印刷散热器的评估


在本文中，我们提出了一种新的封装技术，能够开发适用于恶劣环境的高性能电源模块。该方法基于选择性激光熔化（SLM）技术的使用，以便在金属化基板的背面直接印刷金属散热器。为了探索该方法的可行性，在制造过程后对组装的零件进行了彻底的评估。此外，在恶劣条件下的老化过程中评估了它们的稳健性。结果表明，打印合金的极限抗拉强度和屈服强度高于铸造 AlSi7Mg0.6 合金。打印合金与基底Al金属层之间的界面没有显示出任何弱点，剪切应力值高于100 MPa。对于所有散热器图案，由于铝合金蠕变，热循环期间基板翘曲减少，而高度弯曲的基板在 400 次循环后出现陶瓷裂纹。因此，直接印刷具有基于翅片阵列的图案的散热器为高可靠性、高性能功率模块封装提供了一条有前途的道路。