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Contactless Optical Packaging Concept for Laser to Fiber Coupling
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.3 ) Pub Date : 2021-05-18 , DOI: 10.1109/tcpmt.2021.3080513
Saood Ibni Nazir , Yves Bellouard

A novel method for the laser to fiber coupling is presented in which coarse alignment is achieved through micromachined v-grooves and mirrors in a fused silica substrate. Furthermore, fine repositioning is done in a noncontact manner by using a femtosecond laser to induce localized nanoscopic volume changes in specific locations within the bulk of the substrate, which, once combined with monolithic flexures within the substrate, produces a highly controlled motion. Using this principle, we overcome inherent manufacturing/assembly tolerances to achieve near theoretical coupling efficiency in a permanent manner. This proof of concept demonstrates a novel packaging principle where a sub-nm positioning resolution is achieved over tens of micrometers range of motion, efficiently overcoming intrinsic manufacturing tolerances.

中文翻译:


用于激光与光纤耦合的非接触式光学封装概念



提出了一种激光与光纤耦合的新颖方法,其中通过熔融石英基板中的微加工 V 形槽和镜子实现粗对准。此外,通过使用飞秒激光以非接触方式完成精细重新定位,以在基板主体内的特定位置引起局部纳米级体积变化,一旦与基板内的整体弯曲结合,就会产生高度受控的运动。利用这一原理,我们克服了固有的制造/装配公差,以永久的方式实现接近理论的耦合效率。这一概念验证展示了一种新颖的封装原理,在数十微米的运动范围内实现了亚纳米定位分辨率,有效克服了固有的制造公差。
更新日期:2021-05-18
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