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IEEE Components, Packaging, and Manufacturing Technology Society Information
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.2 ) Pub Date : 2021-06-15 , DOI: 10.1109/tcpmt.2021.3086949


Presents a listing of the editorial board, board of governors, current staff, committee members, and/or society editors for this issue of the publication.

中文翻译:

IEEE 组件、封装和制造技术协会信息

列出本期出版物的编辑委员会、理事会、现任工作人员、委员会成员和/或学会编辑。
更新日期:2021-06-18
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