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Fabrication of high-aspect-ratio grooves with high surface quality by using femtosecond laser
Industrial Lubrication and Tribology ( IF 1.5 ) Pub Date : 2021-06-10 , DOI: 10.1108/ilt-11-2020-0432
Ru Zhang , Chuanzhen Huang , Jun Wang , Hongtao Zhu , Hanlian Liu

Purpose

The purpose of this study is to fabricate high-aspect-ratio grooves with high surface quality by femtosecond laser (FS) to improve the machinability of silicon carbide (SiC) and optimize the process parameters in micromechanical applications.

Design/methodology/approach

Four contrast experiments are reported to characterize the FS laser grooving process for SiC with polarization direction, crystal orientation, multi-pass scanning and z layer feed, respectively. The effects of different experimental conditions on the groove characteristics, material removal rate (MRR), aspect ratio, heat affected zone (HAZ) and surface roughness Ra are analyzed.

Findings

The influence of increasing laser fluence and multi-scanning pass on the groove depth is greater than on the groove width. The MRR, aspect ratio, HAZ and Ra increased with the increase of laser fluence and multi-scanning pass. The direction of laser polarization affects the direction of hot electron injection but has little effect on the material characteristics. FS laser ablation is an isotropic process and there is no obvious change in different crystal orientations. The z-layer feed can significantly increase the groove width and depth and reduce HAZ and Ra. The maximum aspect ratio of 82.67% was fabricated.

Originality/value

The results contribute to the understanding of the removal mechanism and reduce the friction of the microfluidic device and improve the flowability in the FS laser ablation of SiC. This paper provides suggestions for the selection of suitable process parameters and provides a wider possibility for the application of micro-texture on SiC.



中文翻译:

使用飞秒激光制造具有高表面质量的高纵横比凹槽

目的

本研究的目的是通过飞秒激光 (FS) 制造具有高表面质量的高纵横比凹槽,以提高碳化硅 (SiC) 的可加工性并优化微机械应用中的工艺参数。

设计/方法/方法

据报道,四个对比实验分别用偏振方向、晶体取向、多通道扫描和 z 层进给来表征 SiC 的 FS 激光开槽工艺。分析了不同实验条件对凹槽特性、材料去除率(MRR)、纵横比、热影响区(HAZ)和表面粗糙度Ra的影响。

发现

增加激光能量密度和多次扫描对凹槽深度的影响大于对凹槽宽度的影响。MRR、纵横比、HAZ和Ra随着激光能量密度和多次扫描次数的增加而增加。激光偏振方向影响热电子注入方向,但对材料特性影响不大。FS激光烧蚀是一个各向同性的过程,不同的晶体取向没有明显的变化。z层进料可以显着增加槽宽和深度,降低HAZ和Ra。制造的最大纵横比为 82.67%。

原创性/价值

结果有助于理解去除机制,减少微流体装置的摩擦,提高 SiC 的 FS 激光烧蚀的流动性。本文为选择合适的工艺参数提供了建议,为微织构在 SiC 上的应用提供了更广泛的可能性。

更新日期:2021-08-02
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