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Fabrication of Copper Patterns on Polydimethylsiloxane through Laser-Induced Selective Metallization
Industrial & Engineering Chemistry Research ( IF 3.8 ) Pub Date : 2021-06-14 , DOI: 10.1021/acs.iecr.1c01668 Haoran Xu 1 , Jihai Zhang 1 , Jin Feng 1 , Tao Zhou 1
Industrial & Engineering Chemistry Research ( IF 3.8 ) Pub Date : 2021-06-14 , DOI: 10.1021/acs.iecr.1c01668 Haoran Xu 1 , Jihai Zhang 1 , Jin Feng 1 , Tao Zhou 1
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Selective metallization is widely used in the fabrication of conductive circuits and metallized patterns. In this work, a facile approach for the fabrication of copper patterns on polydimethylsiloxane (PDMS) substrates was developed through a 1064 nm pulsed near-infrared (NIR) laser activation and selective metallization. The laser sensitizer of copper hydroxyl phosphate [Cu2(OH)PO4] and antimony-doped tin oxide (ATO) were incorporated into PDMS resin to prepared laser direct structuring (LDS) materials, respectively. The physical morphology and chemical composition of PDMS/Cu2(OH)PO4 and PDMS/ATO after 1064 nm pulsed NIR laser activation and metallization characterizations were determined. The laser-irradiated area of the PDMS substrate exhibited catalyst activation, which could trigger an electroless copper plating (ECP) reaction. The obtained copper patterns exhibit strong mechanical adhesion on the PDMS substrate, which reaches class 5B level after an adhesive tape test (ASTM D3359 standard). Moreover, the conductivity of the obtained copper pattern on PDMS/Cu2(OH)PO4 and PDMS/ATO is around 2.09 × 107 and 1.38 × 107 Ω–1·m–1. This study provides a strategy to fabricate PDMS-based LDS materials for large-scale industrial applications.
中文翻译：
通过激光诱导选择性金属化在聚二甲基硅氧烷上制备铜图案
选择性金属化广泛用于制造导电电路和金属化图案。在这项工作中，通过 1064 nm 脉冲近红外 (NIR) 激光激活和选择性金属化，开发了一种在聚二甲基硅氧烷 (PDMS) 基板上制造铜图案的简便方法。将羟基磷酸铜[Cu 2 (OH)PO 4 ]和掺锑氧化锡(ATO)的激光增感剂分别掺入PDMS树脂中制备激光直接成型(LDS)材料。PDMS/Cu 2 (OH)PO 4的物理形态和化学成分和 PDMS/ATO 在 1064 nm 脉冲 NIR 激光激活和金属化表征后确定。PDMS 基板的激光照射区域表现出催化剂活化，这可能引发化学镀铜 (ECP) 反应。获得的铜图案在PDMS基材上表现出很强的机械附着力，在胶带测试（ASTM D3359标准）后达到5B级水平。此外，所获得的铜图案在PDMS/Cu 2 (OH)PO 4和PDMS/ATO上的电导率约为2.09 × 10 7和1.38 × 10 7 Ω –1 ·m –1。这项研究为制造用于大规模工业应用的基于 PDMS 的 LDS 材料提供了一种策略。
更新日期：2021-06-23
中文翻译：
通过激光诱导选择性金属化在聚二甲基硅氧烷上制备铜图案
选择性金属化广泛用于制造导电电路和金属化图案。在这项工作中，通过 1064 nm 脉冲近红外 (NIR) 激光激活和选择性金属化，开发了一种在聚二甲基硅氧烷 (PDMS) 基板上制造铜图案的简便方法。将羟基磷酸铜[Cu 2 (OH)PO 4 ]和掺锑氧化锡(ATO)的激光增感剂分别掺入PDMS树脂中制备激光直接成型(LDS)材料。PDMS/Cu 2 (OH)PO 4的物理形态和化学成分和 PDMS/ATO 在 1064 nm 脉冲 NIR 激光激活和金属化表征后确定。PDMS 基板的激光照射区域表现出催化剂活化，这可能引发化学镀铜 (ECP) 反应。获得的铜图案在PDMS基材上表现出很强的机械附着力，在胶带测试（ASTM D3359标准）后达到5B级水平。此外，所获得的铜图案在PDMS/Cu 2 (OH)PO 4和PDMS/ATO上的电导率约为2.09 × 10 7和1.38 × 10 7 Ω –1 ·m –1。这项研究为制造用于大规模工业应用的基于 PDMS 的 LDS 材料提供了一种策略。
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