Abstract

The present study numerically simulates a new circular micro heat sink (HS) used to cool electronic equipment (i.e., CPU). The HS contained Al₂O₃-water nanofluid (NF) at the concentration of 0–1%. The HS had a diameter and a thickness of 7.6 and 0.5 mm, respectively. It included two separate inlets with a 6 mm-diameter middle section subjected to a fixed heat flux of 100 W/cm². NF flows were employed to cool the HS at the Reynolds numbers of 500–1500. The FVM-based SIMPLE algorithm was developed to obtain the entropy generation, thermal efficiency, and pressure drop. The results revealed that a rise in Re number and NF concentration enhanced Nu and head loss, while reduced the maximum and average temperatures of the electronic device. The best figure of merit (FOM) of the HS was found to be 1.12. A raise in the fluid velocity and NF concentration increased the pumping power but reduced thermal resistance.

摘要

本研究对用于冷却电子设备（即 CPU）的新型圆形微型散热器 (HS) 进行了数值模拟。HS 含有浓度为 0-1% 的 Al ₂ O ₃ -水纳米流体 (NF)。HS 的直径和厚度分别为 7.6 和 0.5 mm。它包括两个独立的入口，中间部分直径为 6 mm，经受 100 W/cm ^{2的固定热通量}. NF 流被用来冷却 HS 的雷诺数为 500-1500。开发了基于 FVM 的 SIMPLE 算法以获得熵生成、热效率和压降。结果表明，Re数和NF浓度的增加会增加Nu和水头损失，同时降低电子设备的最高温度和平均温度。发现 HS 的最佳品质因数 (FOM) 为 1.12。流体速度和 NF 浓度的提高增加了泵送功率，但降低了热阻。