The purpose of this paper is to report on fabrication procedure and present microstructure and dielectric behavior of willemite ceramic material with addition of 5% Li2CO3 as a sintering aid.,The samples were fabricated by ball milling of the ceramic powders, preparation of granulate and pressing and co-firing using temperature profile based on heating microscope observation. The dielectric properties of the material were measured by impedance spectroscopy (Hz-MHz), transmission method (GHz) and time domain spectroscopy (THz). The composition and microstructure of the material were investigated using X-ray diffraction, scanning electron microscopy and energy-dispersive spectroscopy analysis. Ceramic powder was used to fabricate a green tape and low temperature co-fired ceramics (LTCC) multilayer structures, which in the next steps of the research were examined at the angle of cooperation with conductive pastes, strength and geometric repeatability.,The fabricated material showed low sintering temperature (920°C–960°C), low dielectric constant 6.2–6.34 and low dissipation factor at the level of 0.004–0.007. As LTCC material, willemite with 5% Li2CO3 addition showed good compatibility with AgPd conductive paste.,Search for new materials with low dielectric constant, applicable in LTCC technology, and development of their fabrication procedure are important tasks for the progress in modern microwave circuits.

中文翻译：

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含 Li2CO3 的硅锌矿作为 LTCC 微波基板的烧结助剂

本文的目的是报告制备过程并展示添加 5% Li2CO3 作为烧结助剂的硅酸钙陶瓷材料的微观结构和介电行为。和基于加热显微镜观察的温度分布共烧。通过阻抗谱（Hz-MHz）、透射法（GHz）和时域谱（THz）测量材料的介电性能。使用X射线衍射、扫描电子显微镜和能量色散光谱分析研究了材料的组成和微观结构。陶瓷粉末用于制造生带和低温共烧陶瓷（LTCC）多层结构，在下一步的研究中，从与导电膏、强度和几何重复性的配合角度进行了检查。,所制造的材料显示出低烧结温度 (920°C–960°C)、低介电常数 6.2–6.34 和低耗散因子在 0.004–0.007 的水平。作为LTCC材料，添加5% Li2CO3的硅铝石与AgPd导电浆料具有良好的相容性。寻找低介电常数、适用于LTCC技术的新材料及其制造工艺是现代微波电路进步的重要任务。34 和 0.004–0.007 水平的低损耗因数。作为 LTCC 材料，添加 5% Li2CO3 的硅锌矿与 AgPd 导电浆料具有良好的相容性。寻找低介电常数、适用于 LTCC 技术的新材料及其制造工艺是现代微波电路进步的重要任务。34 和 0.004–0.007 水平的低损耗因数。作为LTCC材料，添加5% Li2CO3的硅铝石与AgPd导电浆料具有良好的相容性。寻找低介电常数、适用于LTCC技术的新材料及其制造工艺是现代微波电路进步的重要任务。