The fan-out wafer level package (FOWLP) becomes more and more attractive and popular because of its flexibility to integrate diverse devices into a very small form factor. The strength of ultrathin FOWLP is low, and the low package strength often leads to crack issues. This paper aims to study the strength of thin FOWLP because the low package strength may lead to the reliability issue of package crack.,This paper uses the experimental method (three-point bending test) and finite element method (ANSYS simulation software) to evaluate the FOWLP strength. Two theoretical models of FOWLP strength are proposed. These two models are based on the location of FOWLP initial fracture point.,The results show that the backside protection tape does not have the ability to enhance the FOWLP strength, and the strength of over-molded structure FOWLP is superior to that of other structure FOWLPs with the same thickness level.,There is ample research about the silicon strength and silicon die strength. However, there is little research about the package level strength and no research about the FOWLP strength. The FOWLP is made up of various materials. The effect of individual component and external environment on the FOWLP strength is uncertain. Therefore, the study of strength behavior of FOWLP is significant.

中文翻译：

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扇出晶圆级封装强度的评估

扇出晶圆级封装 (FOWLP) 变得越来越有吸引力和流行，因为它可以灵活地将各种设备集成到一个非常小的外形尺寸中。超薄FOWLP强度低，封装强度低往往会导致开裂问题。本文旨在研究薄型 FOWLP 的强度，因为低封装强度可能导致封装裂纹的可靠性问题。本文采用实验方法（三点弯曲试验）和有限元方法（ANSYS 仿真软件）进行评估FOWLP 实力。提出了两种 FOWLP 强度的理论模型。这两个模型都是基于FOWLP初始断裂点的位置，结果表明背面保护胶带不具备增强FOWLP强度的能力，并且包覆成型结构FOWLP的强度优于同厚度水平的其他结构FOWLP。,关于硅强度和硅片强度有大量研究。然而，关于封装级强度的研究很少，也没有关于FOWLP强度的研究。FOWLP 由各种材料组成。单个组件和外部环境对 FOWLP 强度的影响是不确定的。因此，研究 FOWLP 的强度行为具有重要意义。单个组件和外部环境对 FOWLP 强度的影响是不确定的。因此，研究 FOWLP 的强度行为具有重要意义。单个组件和外部环境对 FOWLP 强度的影响是不确定的。因此，研究 FOWLP 的强度行为具有重要意义。