The purpose of this paper is to present the possibility of technology of chemical metallization for the production of electrodes and resistors based on Ni–P alloy on silicon (Si), alundum (Al2O3) and low temperature cofired ceramic (LTCC) substrates. The developed technology provides low cost in any form.,During the study monocrystalline Si plates and Al2O3 and LTCC substrates were used. On the surface of the substrates, the electrodes (resistors) by the electroless metallization were made. Subsequently, the electrical parameters of obtained structures were measured. Afterwards, trial soldering was made to demonstrate that the layer is fully soldered.,Optimal parameters of the metallization bath were specified. As a result of the research conducted, it has been stated that the most appropriate way leading to the production of soldered metal layers with good adhesion to the portion of selectively activated Si plate and Al2O3 and LTCC substrates comprises the following technology: masking, selective activation, nickel-plating of activated plate. Such obtained metal layers have a great variety of application; in particular they can be used for the preparation of electric contacts in Si solar cells, production of electrodes and resistors and production of electrodes in thermoelectric structures.,The paper presents a new, unpublished method of manufacturing electrodes (resistors) on Si plate and Al2O3 and LTCC substrates.

中文翻译：

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硅和陶瓷基板的选择性金属化

本文的目的是展示化学金属化技术在硅 (Si)、刚玉 (Al2O3) 和低温共烧陶瓷 (LTCC) 基板上生产基于 Ni-P 合金的电极和电阻器的可能性。开发的技术以任何形式提供低成本。在研究期间使用了单晶硅板和 Al2O3 和 LTCC 基板。在基板的表面上，通过化学镀金属制成电极（电阻器）。随后，测量获得的结构的电参数。然后进行试焊以证明该层完全焊接。指定了金属化浴的最佳参数。根据所进行的研究，已经指出，导致产生对选择性活化的Si板和Al 2 O 3 和LTCC衬底的部分具有良好粘附性的焊接金属层的最合适的方法包括以下技术：活性板的掩蔽、选择性活化、镀镍。如此获得的金属层具有广泛的用途；特别是它们可用于制备硅太阳能电池中的电触点、生产电极和电阻器以及生产热电结构中的电极。,本文提出了一种新的、未发表的在硅板和 Al2O3 上制造电极（电阻器）的方法和 LTCC 基板。活性板镀镍。如此获得的金属层具有广泛的用途；特别是它们可用于制备硅太阳能电池中的电触点、生产电极和电阻器以及生产热电结构中的电极。,本文提出了一种新的、未发表的在硅板和 Al2O3 上制造电极（电阻器）的方法和 LTCC 基板。活性板镀镍。如此获得的金属层具有广泛的用途；特别是它们可用于制备硅太阳能电池中的电触点、生产电极和电阻器以及生产热电结构中的电极。,本文提出了一种新的、未发表的在硅板和 Al2O3 上制造电极（电阻器）的方法和 LTCC 基板。