Lead frame tape is a crucial support for lead frames in the IC assembly process. The tape residue on the quad flat non-leaded (QFN) could result in low reliability and failure in electrical conductivity tests. The tape residue would affect overall performance of the chips and contribute to low pass yield. The purpose of this paper is to present an in-depth study of tape residue and factors that may affect it.,An experiment using lead frame and tapes from three manufacturers with two types of die bond adhesives, namely, die attach film (DAF) and wafer back coating (WBC), was conducted. Copper (Cu) wire bonding and die bonding performances were measured in terms of process capability, stitch bond strength and die attach strength.,Results showed that no tape residue was observed on the thermoplastic adhesive-based lead frames manufactured by Hitachi after the de-taping process because of the tape’s thermoplastic adhesive properties.,This paper studies the occurrence of tape residue and a viable solution for it through the correct process optimization and combination of semiconductor manufacturing materials. Factors that may affect tape residue have also been studied and further research can be done to explore other options in the future as an alternate solution.

中文翻译：

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四方扁平无铅封装中引线框胶带残留的深入研究

引线框架胶带是 IC 组装过程中引线框架的重要支撑。四方扁平无铅 (QFN) 上的胶带残留物可能导致可靠性低和导电性测试失败。胶带残留会影响芯片的整体性能并导致低合格率。本文的目的是深入研究胶带残留物及其可能影响的因素。,使用来自三个制造商的引线框架和胶带以及两种类型的芯片键合粘合剂进行实验，即芯片贴膜 (DAF)和晶圆背面涂层 (WBC)，进行。铜 (Cu) 引线键合和芯片键合性能根据工艺能力、针脚键合强度和芯片连接强度进行测量。结果表明，由于胶带的热塑性粘合特性，在去胶带工艺后，在日立制造的热塑性粘合剂基引线框架上没有观察到胶带残留物。本文研究了胶带残留物的发生情况，并通过正确的工艺优化和半导体制造材料的组合。还研究了可能影响胶带残留物的因素，并且可以进行进一步研究以探索未来的其他选项作为替代解决方案。