The purpose of this paper is to review possibilities of implementing ceramic additive manufacturing (AM) into electronic device production, which can enable great new possibilities.,A short introduction into additive techniques is included, as well as primary characterization of structuring capabilities, dielectric performance and applicability in the electronic manufacturing process.,Ceramic stereolithography (SLA) is suitable for microchannel manufacturing, even using a relatively inexpensive system. This method is suitable for implementation into the electronic manufacturing process; however, a search for better materials is desired, especially for improved dielectric parameters, lowered sintering temperature and decreased porosity.,Relatively inexpensive ceramic SLA, which is now available, could make ceramic electronics, currently restricted to specific applications, more available.,Ceramic AM is in the beginning phase of implementation in electronic technology, and only a few reports are currently available, the most significant of which is mentioned in this paper.

中文翻译：

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陶瓷微系统的增材制造革命

本文的目的是回顾在电子设备生产中实施陶瓷增材制造 (AM) 的可能性，这可以带来巨大的新可能性。包括对增材技术的简短介绍，以及结构化能力、介电性能的主要表征以及在电子制造过程中的适用性。陶瓷立体光刻 (SLA) 适用于微通道制造，即使使用相对便宜的系统。该方法适合在电子制造过程中实施；然而，需要寻找更好的材料，特别是为了改善介电参数、降低烧结温度和减少孔隙率。现在可用的相对便宜的陶瓷 SLA 可以制造陶瓷电子产品，