Purpose The low-temperature co-fired ceramics (LTCC) microfluidic-microwave devices fabrication requires careful consideration of two main factors: the accuracy of deposition of conductive paths and the modification needed to the standard process of the LTCC technology. Neither of them are well-described in the literature. Design/methodology/approach The first part of this paper deals with the individual impact of screen parameters such as aperture, photosensitive emulsion thickness and mounting angle on the precision of the screen-printed conductive paths fabrication. For the quantitative analysis purposes, the design of experiment method with Taguchi orthogonal array and analysis of variance was used. The second part contains the characterization of the complex permittivity measured for different values of LTCC substrates lamination pressure. Findings It can be concluded, that the combination of aperture, equal to 24 µm, emulsion thickness 20 µm and mounting angle 22.5° ensures the highest quality of printed conductive metallization. Furthermore, the obtained results indicate, that the modification of the lamination pressure does not affect significantly the dielectric parameters of the LTCC substrates. Originality/value This paper shows two aspects of the fabrication of the microfluidic-microwave LTCC devices. First, the resolution of the applied metallization is critical in manufacturing high-frequency structures. The obtained experimental results have shown that optimal screen parameters, in terms of conductive pattern quality, can be found. Second, the received outcomes indicate that the changes in the lamination pressure do not affect significantly the electrical parameters of the substrate. Hence, this effect does not need to be taken into account.

中文翻译：

---

工艺参数对LTCC基板印刷分辨率和介电性能的影响

目的 低温共烧陶瓷 (LTCC) 微流控微波器件的制造需要仔细考虑两个主要因素：导电路径沉积的准确性和对 LTCC 技术标准工艺所需的修改。它们都没有在文献中得到很好的描述。设计/方法/途径 本文的第一部分论述了丝网参数（例如孔径、感光乳剂厚度和安装角度）对丝网印刷导电路径制造精度的个别影响。为了定量分析的目的，使用田口正交阵列和方差分析的实验方法设计。第二部分包含对不同 LTCC 基板层压压力值测量的复介电常数的表征。结果 可以得出结论，孔径等于 24 µm、乳剂厚度 20 µm 和安装角度 22.5° 的组合确保了印刷导电金属化的最高质量。此外，获得的结果表明，层压压力的改变不会显着影响 LTCC 基板的介电参数。原创性/价值 本文展示了微流控微波 LTCC 设备制造的两个方面。首先，应用金属化的分辨率对于制造高频结构至关重要。获得的实验结果表明，可以找到就导电图案质量而言的最佳屏幕参数。第二，收到的结果表明，层压压力的变化不会显着影响基板的电气参数。因此，不需要考虑这种影响。