With the development of high-performance electronic equipment, pool boiling heat transfer has attracted great attentions because of its great heat dissipation capability. Although the physical properties of surface like thermal conductivity and wettability could have important influence on pool boiling, their effect has not been systematically studied. In this work, the copper, nickel and copper-nickel porous tablets were prepared by cold pressing method, which were expected to possess different thermal conductivities. Then, the pool boiling curves and the corresponding bubble dynamics of the porous tablets were experimentally investigated. Results turn out that: The thermal conductivity of a sample plays a more important role on boiling heat transfer than the wettability, because a high thermal conductivity always means a reduced activation time of bubble nucleation. When the thermal conductivity is fixed, a high wettability will enhance the boiling heat transfer because of the enlarged bubble-separation frequency. In this experiment, the 2-layered structure combining 1- layer copper and 1-layer nickel could have a maximum HTC of about 2.7 × 10⁴ W/(m²·k), which is about 1.3 (1.47) times that of only 1-layer copper (1-layer nickel) when the same thickness and porosity is applied, because of the high thermal conductivity and wettability.

随着高性能电子设备的发展，池沸腾传热因其强大的散热能力而备受关注。尽管热导率和润湿性等表面物理性质对池沸腾有重要影响，但尚未系统地研究它们的影响。在这项工作中，通过冷压法制备了铜、镍和铜镍多孔片，预计它们具有不同的热导率。然后，实验研究了多孔片剂的池沸腾曲线和相应的气泡动力学。结果表明：与润湿性相比，样品的热导率对沸腾传热起着更重要的作用，因为高热导率总是意味着气泡成核的激活时间减少。当热导率固定时，由于气泡分离频率增大，高润湿性将增强沸腾传热。在本实验中，1 层铜和 1 层镍相结合的 2 层结构的最大 HTC 约为 2.7 × 10⁴  W/(m ² ·k)，由于高导热性和润湿性，当应用相同的厚度和孔隙率时，大约是仅1层铜（1层镍）的1.3（1.47）倍。