Purpose

This study aims to determine the minimum force required to pull out a surface mount component in printed circuit boards (PCBs) during the wave soldering process through both experimental and numerical procedures.

Design/methodology/approach

An efficient experimental technique was proposed to determine the minimum force required to pull out a surface mount component in PCBs during the wave soldering process.

Findings

The results showed that the pullout force is approximately 0.4 N. Comparing this value with the simulated force exerted by the solder wave on the component ( ≅ 0.001158 N), it can be concluded that the solder wave does not exert sufficient force to remove a component.

Originality/value

This study provides a deep understanding of the wave soldering process regarding the component pullout, a critical issue that usually occurs in the microelectronics industry during this soldering process. By applying both accurate experimental and numerical approaches, this study showed that more tests are needed to evaluate the main cause of this problem, as well as new insights were provided into the depositing process of glue dots on PCBs.

中文翻译：

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模拟波峰焊过程的表面贴装元件剪切力的实验测量

目的

本研究旨在通过实验和数值程序确定在波峰焊接过程中拉出印刷电路板 (PCB) 中的表面贴装元件所需的最小力。

设计/方法/方法

提出了一种有效的实验技术来确定在波峰焊接过程中拉出 PCB 中的表面贴装元件所需的最小力。

发现

结果表明，拔出力约为 0.4 N。将此值与焊波施加在元件上的模拟力进行比较（ ≅ 0.001158 N），可以得出结论，焊波没有施加足够的力来移除元件。

原创性/价值

这项研究深入了解了波峰焊过程中关于元件拔出的问题，这是微电子行业在此焊接过程中经常出现的一个关键问题。通过应用精确的实验和数值方法，这项研究表明需要更多的测试来评估这个问题的主要原因，并且为在 PCB 上的胶点沉积过程提供了新的见解。