The purpose of this paper is to investigate the morphology evolution and the composition transformation of Au-Sn intermetallic compounds (IMCs) of the new Au/Sn-5Sb-1Cu-0.1Ni-0.1Ag/(Au)Ni solder joint during the high temperature aging.,Sn-5Sb-1Cu-0.1Ni-0.1Ag solder balls (500 µm in diameter), heat sink with structure of 7.4 µm Au layer on 5 µm Ni-plated Cu alloy and Si chip with 5.16 µm plated Au were used to fabricate micro-solder joints. The joints were performed in a furnace at 150°C for 150, 250 and 350 h aging. The samples were polished and deep etched before analyzed by metallographic microscope and scanning electron microscopy, respectively. Energy dispersive x-ray spectroscopy was used to identify the composition of the IMCs.,s-(Au,Ni,Cu)10Sn phase is formed during the soldering process. The IMCs evolution has two periods during the aging. The first is the ξ-(Au,Ni,Cu)5Sn, ξ-(Au,Cu)5Sn and δ-AuSn were formed and grew to form a full-compound joint after about 150 h aging. The second is the conversion of the full-compound joint. The IMCs converted to ξ′ phase when the aging time extends to 250 h, and transformed to e-(Au,Ni,Cu)Sn2 and η-(Au,Ni,Cu)Sn4 after 350 h aging. The thicker gold layer and thinner solder joint can promote the growth of the IMCs. s-(Au,Ni,Cu)10Sn emerged in Au/SnSb-CuNiAg/(Au)Ni in this research, which is not usually found.,The results in this study have a significant meaning for the application of the new Sn-5Sb-1Cu-0.1Ni-0.1Ag in harsh conditions.

中文翻译：

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高温时效过程中Au/SnSb-CuN​​iAg/(Au)Ni的显微组织演变

本文的目的是研究新型 Au/Sn-5Sb-1Cu-0.1Ni-0.1Ag/(Au)Ni 焊点在高温下的形貌演变和 Au-Sn 金属间化合物 (IMCs) 的组成转变。温度老化。，Sn-5Sb-1Cu-0.1Ni-0.1Ag 焊球（直径 500 µm）、具有 7.4 µm Au 层结构的散热器和 5 µm 镀镍铜合金和具有 5.16 µm 镀金的 Si 芯片用于制造微型焊点。接头在 150°C 的炉中进行 150、250 和 350 小时时效。在分别用金相显微镜和扫描电子显微镜分析之前，样品被抛光和深度蚀刻。能量色散 X 射线光谱用于确定 IMC 的组成。在焊接过程中形成了 s-(Au,Ni,Cu)10Sn 相。IMCs 的演化在老化过程中有两个阶段。第一个是 ξ-(Au,Ni,Cu)5Sn、ξ-(Au,Cu)5Sn 和 δ-AuSn 在时效约 150 小时后形成并生长形成全复合接头。二是全复合接头的转换。当老化时间延长至 250 h 时，IMCs 转变为 ξ' 相，并在 350 h 老化后转变为 e-(Au,Ni,Cu)Sn2 和 η-(Au,Ni,Cu)Sn4。较厚的金层和较薄的焊点可以促进 IMC 的生长。s-(Au,Ni,Cu)10Sn在本研究中出现在Au/SnSb-CuN​​iAg/(Au)Ni中，这在本研究中并不常见。本研究结果对新型Sn-的应用具有重要意义。 5Sb-1Cu-0.1Ni-0.1Ag 在恶劣条件下。当老化时间延长至 250 h 时，IMCs 转变为 ξ' 相，并在 350 h 老化后转变为 e-(Au,Ni,Cu)Sn2 和 η-(Au,Ni,Cu)Sn4。较厚的金层和较薄的焊点可以促进 IMC 的生长。s-(Au,Ni,Cu)10Sn在本研究中出现在Au/SnSb-CuN​​iAg/(Au)Ni中，这在本研究中并不常见。本研究结果对新型Sn-的应用具有重要意义。 5Sb-1Cu-0.1Ni-0.1Ag 在恶劣条件下。当老化时间延长至 250 h 时，IMCs 转变为 ξ' 相，并在 350 h 老化后转变为 e-(Au,Ni,Cu)Sn2 和 η-(Au,Ni,Cu)Sn4。较厚的金层和较薄的焊点可以促进 IMC 的生长。s-(Au,Ni,Cu)10Sn在本研究中出现在Au/SnSb-CuN​​iAg/(Au)Ni中，这在本研究中并不常见。本研究结果对新型Sn-的应用具有重要意义。 5Sb-1Cu-0.1Ni-0.1Ag 在恶劣条件下。