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A new strategy to reduce edge chipping using stress wave impedance matching
CIRP Annals ( IF 3.2 ) Pub Date : 2021-06-09 , DOI: 10.1016/j.cirp.2021.04.066
Yifan Zhang , Yuyang Zhao , Jundong Xu , Mengqi Rao , Yuehong Yin

To restrain edge chipping and elucidate its mechanism during machining, the initiation of edge chipping was investigated in this study from the propagation properties of stress waves in the fractured media. Three technological principles of the support for chipping suppression were proposed to reduce the intensity of reflected extension waves, namely, the wave impedance matching, the smaller residual gap and the higher viscosity of the gap filler between the workpiece and the support. As demonstrated from the experimental results, using brass support with non-solid epoxy gap filler can significantly restrain the edge chipping of pressureless sintered silicon carbide during grinding.



中文翻译:

一种使用应力波阻抗匹配减少边缘碎裂的新策略

为了抑制边缘崩裂并阐明其在加工过程中的机制,本研究从应力波在断裂介质中的传播特性研究了边缘崩裂的发生。提出了抑制崩刃的支架的三个技术原则,以降低反射扩展波的强度,即波阻抗匹配、较小的残余间隙和工件与支架之间间隙填料的较高粘度。实验结果表明,使用带有非固体环氧树脂间隙填料的黄铜支架可以显着抑制无压烧结碳化硅在磨削过程中的边缘碎裂。

更新日期:2021-07-12
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