Pad asperities in chemical-mechanical polishing (CMP) provide necessary forces for mechanical abrasion. This article investigates the abrasive behaviour of polishing pads at the asperity contact scale. A contact mechanics model predicts that compliant and soft asperities or rigid and hard asperities may solely achieve either large contact area or high indentation depth respectively, whereas bi-layered asperities can enable both the enlarged contact and deep abrasion. Hemispherical pad micro-asperities with precise dimensions, including the new bi-layered design, were fabricated using thermal reflow and micro-replica molding techniques and their polishing behaviours were experimentally compared using a pin-on-disk polishing setup.

化学机械抛光 (CMP) 中的抛光垫凹凸为机械磨损提供了必要的力。本文研究了抛光垫在粗糙接触尺度上的磨蚀行为。接触力学模型预测，柔顺的和软的凹凸不平或刚性和硬的凹凸分别可以单独实现大接触面积或高压痕深度，而双层凹凸可以实现扩大接触和深度磨损。使用热回流和微复制成型技术制造具有精确尺寸的半球形垫微凹凸不平，包括新的双层设计，并使用针盘抛光装置对它们的抛光行为进行实验比较。