Solid-Phase Deposition: Conformal Coverage of Micron-Scale Relief Structures with Stretchable Semiconducting Polymers,ACS Materials Letters

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Solid-Phase Deposition: Conformal Coverage of Micron-Scale Relief Structures with Stretchable Semiconducting Polymers
ACS Materials Letters ( IF 9.6 ) Pub Date : 2021-06-09 , DOI: 10.1021/acsmaterialslett.1c00213
Guillermo L. Esparza _{1,

2} , Darren J. Lipomi _{1,

2}

Affiliation

There are a variety of methods available for forming thin films of electronic polymers, but very few of them are applicable to surfaces bearing relief structures on the micron scale. Of the methods that are capable of conformal coverage of such topography, most are applicable only to coatings that can be polymerized in situ—for example, by chemical vapor deposition—and are, thus, not amenable to polymers with complex molecular structures, such as π-conjugated (semiconducting) polymers. This Letter describes a method termed solid-phase deposition (SPD). The SPD process is a variant of water transfer printing whereby a thin film of a semiconducting polymer is suspended on water and taken up by a substrate bearing micron-scale relief structures (in this case, sharp pyramids etched in silicon). Under ambient conditions, solid films that are sufficiently compliant (thin, ductile, or of low modulus) can coat these surfaces readily. Stiffer films comprising higher modulus polymers can be made amenable to the process by the application of heat or solvent vapor. We successfully formed coatings from films of poly(3-alkylthiophenes) spanning the range from glassy (alkyl = butyl) to rubbery (alkyl = heptyl), along with the low-bandgap polymers DPP-DTT and PTB7-Th, on textured silicon and indium tin oxide (ITO) surfaces.

中文翻译：

固相沉积：具有可拉伸半导体聚合物的微米级浮雕结构的保形覆盖

有多种方法可用于形成电子聚合物的薄膜，但很少有方法适用于带有微米级浮雕结构的表面。在能够共形覆盖这种形貌的方法中，大多数仅适用于可原位聚合的涂层（例如，通过化学气相沉积），因此不适用于具有复杂分子结构的聚合物，例如π-共轭（半导体）聚合物。这封信描述了一种称为固相沉积 (SPD) 的方法。SPD 工艺是水转移印刷的一种变体，其中半导体聚合物薄膜悬浮在水中，并被带有微米级浮雕结构（在这种情况下，在硅中蚀刻的尖锐金字塔）的基板吸收。在环境条件下，足够柔顺（薄、可延展或低模量）的固体薄膜可以很容易地覆盖这些表面。通过施加热量或溶剂蒸气，可以使包含更高模量聚合物的更硬的膜适合该方法。我们成功地从玻璃状（烷基 = 丁基）到橡胶状（烷基 = 庚基）的聚（3-烷基噻吩）薄膜，以及低带隙聚合物 DPP-DTT 和 PTB7-Th，在纹理硅和氧化铟锡 (ITO) 表面。

更新日期：2021-07-05

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