The booming growth in environmental conditions sensing and monitoring pushes the need of inexpensive environment sensors with small size and low power consumption. The outbreak of COVID-19 further increases the need for fast monitoring of environment conditions. The micro-electrical-mechanical-systems (MEMS) technologies are considered as promising solutions to realize the required environment sensors. The mature complementary metal-oxide-semiconductor (CMOS) process platforms available in many foundries can be extended to fabricate MEMS sensors to offer the advantage of relatively easier commercialization. Moreover, by leveraging the characteristics of CMOS process platforms, the integration of multiple sensors and sensing circuits to form a compact sensing system can also be achieved. This review paper will focus on introducing the miniaturized environmental sensing devices implemented and integrated using the CMOS-MEMS technologies. In general, the CMOS chips for environment sensing are firstly fabricated using the foundry-available CMOS processes, and then the post-CMOS micromachining processes are performed to implement the CMOS-MEMS environment sensors. This paper respectively reviews five different environment sensors (including the infrared, pressure (barometer), humidity/temperature, and gas sensors) using the CMOS-based MEMS technologies. The advantages and design concerns of sensors fabricated by different CMOS and post-CMOS processes are introduced and discussed. Moreover, the CMOS-MEMS environment sensing hub implemented through the monolithic integration of multiple environment sensors is also introduced.

环境条件传感和监测的蓬勃发展推动了对小尺寸、低功耗的廉价环境传感器的需求。COVID-19 的爆发进一步增加了对环境条件快速监测的需求。微机电系统 (MEMS) 技术被认为是实现所需环境传感器的有前途的解决方案。许多代工厂提供的成熟互补金属氧化物半导体 (CMOS) 工艺平台可以扩展到制造 MEMS 传感器，以提供相对更容易商业化的优势。此外，利用CMOS工艺平台的特性，还可以实现多个传感器和传感电路的集成，形成一个紧凑的传感系统。本文将重点介绍使用 CMOS-MEMS 技术实现和集成的小型化环境传感设备。通常，用于环境传感的 CMOS 芯片首先使用代工厂可用的 CMOS 工艺制造，然后进行后 CMOS 微加工工艺以实现 CMOS-MEMS 环境传感器。本文分别回顾了五种不同的环境传感器（包括红外线、压力（气压计）、湿度/温度和气体传感器）使用基于 CMOS 的 MEMS 技术。介绍并讨论了由不同 CMOS 和后 CMOS 工艺制造的传感器的优点和设计问题。此外，还介绍了通过多个环境传感器的单片集成实现的CMOS-MEMS环境传感中枢。