Chinese Physics B ( IF 1.5 ) Pub Date : 2021-05-20 , DOI: 10.1088/1674-1056/abd749 Yu Fu 1 , Rui-Min Xu 1 , Xin-Xin Yu 2 , Jian-Jun Zhou 2 , Yue-Chan Kong 2 , Tang-Sheng Chen 2 , Bo Yan 1 , Yan-Rong Li 1, 3 , Zheng-Qiang Ma 4 , Yue-Hang Xu 1
The interface state of hydrogen-terminated (C–H) diamond metal–oxide–semiconductor field-effect transistor (MOSFET) is critical for device performance. In this paper, we investigate the fixed charges and interface trap states in C–H diamond MOSFETs by using different gate dielectric processes. The devices use Al2O3 as gate dielectrics that are deposited via atomic layer deposition (ALD) at 80 C and 300 C, respectively, and their C–V and I–V characteristics are comparatively investigated. Mott–Schottky plots (1/C 2–V G) suggest that positive and negative fixed charges with low density of about 1011 cm−2 are located in the 80-C- and 300-C deposition Al2O3 films, respectively. The analyses of direct current (DC)/pulsed I–V and frequency-dependent conductance show that the shallow interface traps (0.46 eV–0.52 eV and 0.53 eV–0.56 eV above the valence band of diamond for the 80-C and 300-C deposition conditions, respectively) with distinct density (7.8 1013 eV−1⋅cm−2–8.5 1013 eV−1⋅cm−2 and 2.2 1013 eV−1⋅cm−2–5.1 1013 eV−1⋅cm−2 for the 80-C- and 300-C-deposition conditions, respectively) are present at the Al2O3/C–H diamond interface. Dynamic pulsed I–V and capacitance dispersion results indicate that the ALD Al2O3 technique with 300-C deposition temperature has higher stability for C–H diamond MOSFETs.
中文翻译:
国家自然科学基金项目(61922021号)、国家重点研发计划项目(2018YFE0115500)、四川省宽带微波电路高密度集成工程技术研究中心基金资助。
氢封端 (C-H) 金刚石金属氧化物半导体场效应晶体管 (MOSFET) 的界面态对器件性能至关重要。在本文中,我们通过使用不同的栅极介电工艺研究了 C-H 金刚石 MOSFET 中的固定电荷和界面陷阱态。这些器件使用 Al 2 O 3作为栅极电介质,分别在 80 C 和 300 C 下通过原子层沉积 (ALD) 沉积,并比较研究了它们的C - V和I - V特性。Mott–Schottky plots (1/ C 2 – V G ) 表明正负固定电荷密度约为 1011 cm -2分别位于80-C-和300-C沉积Al 2 O 3膜中。直流 (DC)/脉冲I – V和频率相关电导的分析表明,在 80-C 和 300- C沉积条件,分别)具有不同的密度(7.8 10 13 eV -1 ⋅cm -2 –8.5 10 13 eV -1 ⋅cm -2和 2.2 10 13 eV -1 ⋅cm -2 –5.1 10 13 eV -1⋅cm -2分别用于 80-C 和 300-C 沉积条件)存在于 Al 2 O 3 /C-H 金刚石界面处。动态脉冲I - V和电容色散结果表明,沉积温度为 300-C 的 ALD Al 2 O 3技术对 C-H 金刚石 MOSFET 具有更高的稳定性。