Transfer printing based on switchable adhesive that heterogeneously integrates materials is essential to develop novel electronic systems, such as flexible electronics and micro LED displays. Here, we report a robust design of a thermal actuated switchable dry adhesive, which features a stiff sphere embedded in a thermally responsive shape memory polymer (SMP) substrate and encapsulated by an elastomeric membrane. This construct bypasses the unfavorable micro- and nano-fabrication processes and yields an adhesion switchability of over 1000 by combining the peel-rate dependent effect of the elastomeric membrane and the thermal actuation of the sub-surface embedded stiff sphere. Experimental and numerical studies reveal the underlying thermal actuated mechanism and provide insights into the design and operation of the switchable adhesive. Demonstrations of this concept in stamps for transfer printing of fragile objects, such as silicon wafers, silicon chips, and inorganic micro-LED chips, onto challenging non-adhesive surfaces illustrate its potential in heterogeneous material integration applications, such as flexible electronics manufacturing and deterministic assembly.

基于异质集成材料的可切换粘合剂的转移印刷对于开发新型电子系统至关重要，例如柔性电子和微型 LED 显示器。在这里，我们报告了一种热驱动可切换干式粘合剂的稳健设计，其特点是刚性球体嵌入热响应形状记忆聚合物 (SMP) 基板中，并由弹性膜封装。这种构造绕过了不利的微米和纳米制造过程，通过结合弹性膜的剥离速率相关效应和亚表面嵌入刚性球体的热驱动，产生超过 1000 的粘附切换能力。实验和数值研究揭示了潜在的热驱动机制，并为可切换粘合剂的设计和操作提供了见解。