当前位置: X-MOL 学术IEEE Microw. Wirel. Compon. Lett. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
W-Band Waveguide Module Design for Power Combining of Linear Microstrip Array
IEEE Microwave and Wireless Components Letters ( IF 3 ) Pub Date : 2021-04-23 , DOI: 10.1109/lmwc.2021.3075243
C. Yi , K. Kim , H. J. Kim , M. Kim

A $W$ -band metallic waveguide module capable of spatial power combining of linear microstrip array is presented. The module employs two uniquely devised split-channel blocks to obtain a uniform field distribution in an oversize merged channel and couple an equal amount of power to ten microstrip elements aligned in the direction of the waveguide $E$ -plane. The array of microstrip thru lines, each with a pair of bonding wires, is fabricated on a single dielectric substrate. The measurements indicate that the merged-channel power-combining scheme is properly operating as the two modules separately built to house single and array elements show similar frequency response with flat insertion losses of 2–3 dB between 90 and 98 GHz.

中文翻译:

-用于线性微带阵列功率合并的波段波导模块设计

一种 $W$ 提出了能够进行线性微带阵列空间功率组合的带金属波导模块。该模块采用两个独特设计的分离通道块,在超大合并通道中获得均匀的场分布,并将等量的功率耦合到与波导方向对齐的十个微带元件 $E$ -飞机。微带直通线阵列,每条都有一对键合线,制作在单个介电基板上。测量结果表明,合并通道功率合并方案运行正常,因为单独构建的两个模块用于容纳单个和阵列元件,显示出相似的频率响应,在 90 和 98 GHz 之间具有 2–3 dB 的平坦插入损耗。
更新日期:2021-06-08
down
wechat
bug