The development of miniaturized and more powerful electronic devices and microprocessors has resulted in high heat generation and temperature values in these components. That affects the performance, reliability and lifespan of the devices. In addition, more local hot spots are generated in the components that require even more attention to prevent stress failure and fatigue. As such, the employment of advanced electronics cooling systems is very essential to keep the temperature below the safe temperature. In this work, innovative cooling systems are developed and analyzed employing jet impingement technology, high conductive metal foam, rib structured target surfaces, confined non-uniform small-scale channel, and conductive heat spreader plate. The base of the foam-filled cooling channel is subject to a uniform high heat flux value resembling the electronics device to be cooled. For numerical modeling of thermal transport through foam filled region, the local thermal non-equilibrium model in porous media is utilized resulting in two energy equations for solid and fluid phases. For better understanding of flow and thermal characteristics of jet impingement through the combination of metal foam and rib structured surfaces in confined channels, several effective parameters are studied such as slot and circular jet impingements, the shape and orientation of the ribs, impinging jet velocity, applied heat flux and the thickness of conductive heat spreader plate for hotspot removal. The results show that the fully foam filled channel provides a more efficient cooling in comparison with partially foam filled channel. Furthermore, the results indicate the advantage of utilization of ribs at the stagnation region of the impinging jet, for local thermal treatment of hotspots. The perpendicular cuboid ribs placed at the stagnation zone of the coolant jet impingement provide 13% increase in maximum local Nusselt number while the increase in the pressure drop and required pumping power are as small as 4.2%. Doubling the velocity would result in 35.3% increase in the maximum local Nusselt number, 180% increase in the pressure drop and 460.7% increase in the required pumping power. An increase in the thickness of the conductive heat spreader plate increases the base local temperature but improves local temperature uniformity.

小型化和更强大的电子设备和微处理器的发展导致这些组件产生高热量和温度值。这会影响设备的性能、可靠性和使用寿命。此外，部件中会产生更多的局部热点，需要更加注意防止应力失效和疲劳。因此，采用先进的电子冷却系统对于将温度保持在安全温度以下非常重要。在这项工作中，利用射流冲击技术、高导电泡沫金属、肋结构目标表面、受限非均匀小尺度通道和导热散热板开发和分析了创新的冷却系统。填充泡沫的冷却通道的底部受到类似于要冷却的电子设备的均匀高热通量值。对于通过泡沫填充区域的热传输的数值模拟，多孔介质中的局部热非平衡模型被利用，从而产生固相和流体相的两个能量方程。为了更好地理解在受限通道中通过金属泡沫和肋结构表面的组合射流冲击的流动和热特性，研究了几个有效参数，如狭缝和圆形射流冲击、肋的形状和方向、冲击射流速度、施加的热通量和用于去除热点的导热散热板的厚度。结果表明，与部分泡沫填充的通道相比，完全泡沫填充的通道提供了更有效的冷却。此外，结果表明在撞击射流的停滞区域利用肋条对热点进行局部热处理具有优势。放置在冷却剂射流冲击停滞区的垂直长方体肋使最大局部努塞尔数增加 13%，而压降和所需泵送功率的增加小至 4.2%。速度加倍将导致最大局部努塞尔数增加 35.3%，压降增加 180%，所需泵送功率增加 460.7%。导热散热板厚度的增加会增加基础局部温度，但会改善局部温度均匀性。