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Effect of in situ graphene-doped nano-CeO2 on microstructure and electrical contact properties of Cu30Cr10W contacts
Nanotechnology Reviews ( IF 6.1 ) Pub Date : 2021-01-01 , DOI: 10.1515/ntrev-2021-0031
Shengli Liang 1, 2, 3, 4 , Shuang Liu 1, 2, 3, 4 , Yi Zhang 1, 2, 3, 4 , Meng Zhou 1, 2, 3, 4 , Baohong Tian 1, 2, 3, 4 , Yongfeng Geng 1, 2, 3, 4 , Yong Liu 1, 2, 3, 4 , Yanlin Jia 5 , Xu Li 6 , Alex A. Volinsky 7
Affiliation  

The graphene oxide (GO)-doped nano-CeO 2 was introduced into Cu30Cr10W electrical contact composites by ball milling dispersion, freeze-drying, and spark plasma sintering, resulting in excellent mechanical strength and high arc erosion resistance. The effects of GO and CeO 2 on the microstructure and properties of the composites were investigated. The arc erosion behavior was investigated by the JF04C electrical contact testing apparatus. Consequently, the uniform distribution of CeO 2 nanoparticles hinders the movement of dislocations, GO transformed into reduced graphene oxide (rGO) during high-temperature sintering, and the in situ formation of Cr 3 C 2 between trace carbon atoms and chromium particles at the C–Cu interface, which enhanced the interface combination. Compared with Cu30Cr10W composites, the tensile strength of the two composites was increased by 47 and 36% by importing GO and nano-CeO 2 , respectively. Finally, electrode material migrated from the cathode to the anode, and the rGO delayed the formation of pits and sharp bumps on the contact surface of the electrode and inhibited diffusion of molten metal; when compared with Cu30Cr10W, the GO/CeO 2 –Cu30Cr10W composites have better welding force. Graphical abstract

中文翻译:

原位石墨烯掺杂纳米CeO2对Cu30Cr10W触点微观结构和电接触性能的影响

通过球磨分散、冷冻干燥和放电等离子烧结将氧化石墨烯(GO)掺杂的纳米CeO 2 引入到Cu30Cr10W电触点复合材料中,具有优异的机械强度和高抗电弧腐蚀性能。研究了GO和CeO 2 对复合材料微观结构和性能的影响。电弧腐蚀行为通过JF04C电接触测试仪进行研究。因此,CeO 2 纳米颗粒的均匀分布阻碍了位错的运动,在高温烧结过程中GO转化为还原氧化石墨烯(rGO),以及在C处的痕量碳原子和铬颗粒之间原位形成Cr 3 C 2 –Cu界面,增强了界面组合。与Cu30Cr10W复合材料相比,通过导入GO和纳米CeO 2 ,​​两种复合材料的拉伸强度分别提高了47%和36%。最后,电极材料从阴极迁移到阳极,rGO延迟了电极接触面上凹坑和尖锐凸起的形成,抑制了熔融金属的扩散;与Cu30Cr10W相比,GO/CeO 2 -Cu30Cr10W复合材料具有更好的焊接力。图形概要
更新日期:2021-01-01
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