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High-quality factor multipath differential fractal inductor for wireless applications
Circuit World ( IF 0.8 ) Pub Date : 2021-05-31 , DOI: 10.1108/cw-09-2020-0264
Sunil Kumar Tumma , Bheema Rao Nistala

Purpose

The purpose of this study is to develop a high-quality factor fractal inductor for wireless applications such as satellite, WLAN, Bluetooth, microwave, radar and cellular phone.

Design/methodology/approach

The Hilbert fractal curve is used in the implementation of the proposed inductor. In the proposed inductor, the metal width has split into multiple paths based on the skin depth of the metal. The simulations of the proposed inductor are performed in 180 nm CMOS technology using the Advanced Design System EM simulator.

Findings

The multipath technique reduces the skin effects and proximity effects, which, in turn, decreases the series resistance of the inductor and attains high-quality factor over conventional fractal inductor for the equal on-chip area.

Research limitations/implications

The width of the path has chosen higher than the skin depth of the metal for a required operating frequency. Due to cost constraints, the manufacturing of the proposed fractal inductor is limited to a single layer.

Practical implications

The proposed inductor will be useful for the implementation of critical building blocks of radio frequency integrated circuits and monolithic microwave integrated circuits such as low-noise amplifiers, voltage-controlled oscillators, mixers, filters and power amplifiers.

Originality/value

This paper presents for the first time the use of a multipath technique for the fractal inductors to enhance the quality factor.



中文翻译:

用于无线应用的高品质因数多径差分分形电感器

目的

本研究的目的是为卫星、WLAN、蓝牙、微波、雷达和蜂窝电话等无线应用开发高品质因数分形电感器。

设计/方法/方法

希尔伯特分形曲线用于实施所提出的电感器。在所提出的电感器中,金属宽度已根据金属的趋肤深度分成多个路径。所提出的电感器的仿真是在 180 nm CMOS 技术中使用 Advanced Design System EM 仿真器进行的。

发现

多路径技术减少了趋肤效应和邻近效应,进而降低了电感器的串联电阻,并在相同的片上面积上获得了优于传统分形电感器的高质量因数。

研究限制/影响

对于所需的工作频率,路径的宽度已选择高于金属的趋肤深度。由于成本限制,所提出的分形电感器的制造仅限于单层。

实际影响

所提出的电感器将有助于实现射频集成电路和单片微波集成电路的关键构建块,例如低噪声放大器、压控振荡器、混频器、滤波器和功率放大器。

原创性/价值

本文首次介绍了对分形电感器使用多径技术来提高品质因数。

更新日期:2021-05-31
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