High-speed switching capabilities of modern ICs cause generating more heat, and it must be ejected via metallic heat-sinks behaving as an antenna at certain frequencies. Having different radiation patterns(RP) at different frequencies may cause a malfunction on nearby electronics placed on the other part of PCB. In this study, 50W equivalent heat-sink is investigated at 2-8 GHz in terms of feeding point. RP measurements and simulation results at four different feeding points are discussed, and it is observed that point of feeding is the pre-dominant factor of RP. As expected, the feeding of the heat-sinks from the center is to be preferred for lower frequencies, but it causes critical emission/interference problems at higher frequencies. As the frequency increases, it metamorphoses like a frog forming. While it behaves as an omnidirectional antenna having $(\sim 2\text{dB})$ gain at 2GHz, RP turns to one that includes 6 beams with 30-degree beam-widths and $(\sim 5\text{dB})$ gain.

现代 IC 的高速开关能力会产生更多的热量，并且必须通过在某些频率下充当天线的金属散热器将其排出。在不同频率下具有不同的辐射模式 (RP) 可能会导致放置在 PCB 另一部分的附近电子设备出现故障。在这项研究中，就馈电点而言，在 2-8 GHz 下研究了 50W 等效散热器。讨论了四个不同进料点的 RP 测量和模拟结果，观察到进料点是 RP 的主要因素。正如预期的那样，从中心向散热器馈电对于较低频率是首选，但在较高频率会导致严重的发射/干扰问题。随着频率的增加，它会像青蛙一样变形。$(～2\text{D b})$ 在 2GHz 时获得增益，RP 变为一个包括 6 个波束宽度为 30 度的波束和 $(～5\text{D b})$ 获得。