当前位置: X-MOL 学术Microelectron. Reliab. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
Three-dimensional moisture diffusion simulation with time dependent saturated concentration in ANSYS through native thermal and spring elements
Microelectronics Reliability ( IF 1.6 ) Pub Date : 2021-05-29 , DOI: 10.1016/j.microrel.2021.114167
S.V.K. Anicode , E. Madenci

This study presents a new modeling approach for moisture concentration in the presence of time dependent saturated moisture concentration and diffusivity by considering only native ANSYS elements. It removes the shortcomings of the ANSYS “diffusion” and “coupled field” elements by employing thermal (LINK33, PLANE55 and SOLID70) and spring (COMBIN14) elements. The accuracy of this modeling approach is established by demonstrating desorption and absorption process in a bar made of two different materials with equal and unequal values of solubility activation energy in the presence of time dependent saturated moisture concentration under uniform and nonuniform temperature conditions. Also, it is applied to a representative three-dimensional electronic package configuration to demonstrate the effect of time dependent saturated moisture concentration on moisture diffusion and weight gain.



中文翻译:

在 ANSYS 中通过原生热元素和弹簧元素对时间相关饱和浓度进行三维水分扩散模拟

本研究通过仅考虑原生 ANSYS 元素,在存在时间相关的饱和水分浓度和扩散率的情况下,提出了一种新的水分浓度建模方法。它通过使用热(LINK33、PLANE55 和 SOLID70)和弹簧 (COMBIN14) 单元消除了 ANSYS“扩散”和“耦合场”单元的缺点。这种建模方法的准确性是通过在均匀和非均匀温度条件下,在存在时间依赖的饱和水分浓度的情况下,演示由两种不同材料制成的棒的解吸和吸收过程而建立的,该棒具有相等和不等的溶解活化能值。还,

更新日期:2021-05-30
down
wechat
bug