The trend of electrification and miniaturization brings the reliability of interconnects to the forefront. The solder joints are subjected to thermo-mechanical mismatch due to the Joule heating and electromigration (EM)-induced degradation under high current stressing conditions. However, most of the studies are limited to lab test samples or lab test conditions, which lack transferability in engineering applications. In this paper, automotive electronic components are studied subjected to field-like current pulse conditions. The work aims to understand the field-relevant failure modes of solder joints exposed to high current stressing via experimental and numerical investigations. Shunt components with and without Ni plating are analyzed in power cycling tests. A polarity effect is observed in the growth of intermetallic compounds (IMCs). The thickness of IMC at the anode exhibits an approximately linear growth with current stressing time, whereas the thickness of IMC at the cathode remains almost unchanged or slightly decreased. Ni, as diffusion barrier, serves to restrain Cu consumption from the terminals of shunts and also reduces Cu mass transport into and within the solder. The net Cu flux at the interface and in the solder is discussed to analyze the IMC growth kinetics. The shunts with Ni plating undergo less EM of Cu and yield longer lifetime. Voids and crack formation are detected in computer tomography (CT) scans and cross-sectional analysis by scanning electron microscopy (SEM). Finite element method (FEM) is implemented to simulate thermo-electro-mechanical fields of the assembly under power cycling test conditions. The distribution of divergence of material flux density corresponds well with the location of voids formation and provides good estimation for the lifetime.

电气化和小型化的趋势将互连的可靠性带到了最前沿。在高电流应力条件下，由于焦耳加热和电迁移 (EM) 引起的退化，焊点会发生热机械失配。然而，大多数研究仅限于实验室测试样品或实验室测试条件，在工程应用中缺乏可转移性。在本文中，汽车电子元件在类场电流脉冲条件下进行了研究。这项工作旨在通过实验和数值研究了解暴露于高电流应力的焊点的现场相关故障模式。在功率循环测试中分析了镀镍和未镀镍的分流元件。在金属间化合物 (IMC) 的生长中观察到极性效应。阳极 IMC 的厚度随着电流应力时间呈现近似线性增长，而阴极 IMC 的厚度几乎保持不变或略有下降。Ni 作为扩散屏障，用于限制分流器端子的 Cu 消耗，并减少 Cu 质量传输到焊料中和焊料内部。讨论界面处和焊料中的净铜通量以分析 IMC 生长动力学。镀镍分流器对铜的 EM 更小，使用寿命更长。在计算机断层扫描 (CT) 扫描和横截面分析中通过扫描电子显微镜 (SEM) 检测空隙和裂纹形成。实施有限元方法 (FEM) 来模拟功率循环测试条件下组件的热机电场。