The dielectric characteristics of heat-resistant spheroplastics based on hollow ceramic microspheres and a heat-resistant binder based on the aromatic polyamide phenylone were investigated. The dielectric characteristics were measured by the waveguide method on a laboratory bench. The dependences of the dielectric loss tangent on the frequency and the binder content in spheroplastic were obtained.

中文翻译：

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基于苯醌和空心陶瓷微球的低密度球形塑料的CM-微波介电特性

研究了基于空心陶瓷微球的耐热球形塑料和基于芳族聚酰胺苯酮的耐热粘结剂的介电性能。在实验室工作台上通过波导方法测量介电特性。得到了介电损耗正切与球塑性中的频率和粘合剂含量的关系。