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Solutions of thermal management problems for terminal racks of in-row cooling architectures in data centers
Building and Environment ( IF 7.4 ) Pub Date : 2021-05-26 , DOI: 10.1016/j.buildenv.2021.107991
S.A. Nada , A.M. Abbas

Problems of hot air recirculation, hot spots, and bad performance indices of data centers at terminal racks were noticed and reported in the literature. The present work investigates the possible management solutions of heterogeneous thermal problems for terminal racks in data centers in case of using in-row cooling racks arrays. Three possible solutions, namely using top aisle containments, top and side aisles containments, and air conditioning unit at the start and end of each rack row, are investigated. Computational Fluid Dynamics(CFD) using ANSYS-Icepak software as a specialized software in cooling electronic devices is used to conduct this study. A prototype of a small-scale data center module is experimentally constructed and tested to validate the present CFD work. Supply Heat Index (SHI), Index of Mixing (IOM), Beta Index (β) and Energy Utilization Index (ηr) are utilized to investigate, assess and compare the different suggested solutions. The results show that (i) problems of hot air recirculation, hot spots, and bad performances indices are noticed for the terminal racks if no solution is applied, (ii) using top aisle containments partially solve the heterogeneous thermal problem of terminal racks, (iii) using top and sides containments completely solve the problem of hot air recirculation (iv) starting and ending the racks row with computer air conditioning units solve the problem of the heterogeneous distribution of intake air temperature along with the racks height and (v) Energy Utilization Coefficient of terminal racks is increased by 45% if the top and sides containments are applied or starting the racks row with air conditioning units.



中文翻译:

数据中心行列式冷却架构终端机柜热管理问题解决方案

文献中注意到并报道了终端机架处数据中心的热空气再循环、热点和不良性能指标的问题。目前的工作研究了在使用行内冷却机架阵列的情况下数据中心终端机架异构热问题的可能管理解决方案。研究了三种可能的解决方案,即使用顶部通道密封装置、顶部和侧面通道密封装置以及在每个机架行的开始和结束处使用空调装置。使用 ANSYS-Icepak 软件作为冷却电子设备的专用软件的计算流体动力学 (CFD) 用于进行这项研究。小规模数据中心模块的原型通过实验构建和测试来验证当前的 CFD 工作。供热指数(SHI),混合指数(IOM),r ) 用于调查、评估和比较不同的建议解决方案。结果表明:(i)如果不采用解决方案,终端机柜会出现热空气再循环、热点和不良性能指标的问题,(ii)使用顶部通道围堵部分解决了终端机柜的异质热问题,( iii) 采用顶部和侧面密封,彻底解决热风再循环问题 (iv) 机柜行起止采用计算机空调机组解决进气温度随机柜高度分布不均的问题 (v) 能量如果采用顶部和侧面密封装置或使用空调机组启动机架排,则终端机架的利用率提高 45%。

更新日期:2021-06-02
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