Thermal management in a heat source-based electronic package is a necessity for reliable, long-lasting performance, as it is compulsory to dissipate the generated heat effectively. In this study, a novel nickel-phosphorous (Ni-P) alloy coating on an aluminum substrate is proposed to obtain improved thermal properties such as thermal conductivity (k), total thermal resistance (Rth-tot), and device junction temperature (Tj). The performance of the electroless Ni-P coating is observed under different deposition times and test conditions. The morphology of Ni-P coating results in a cauliflower-like grown structure on a substrate with 91.2 wt% of Ni and 8.8 wt% of P. X-ray diffraction spectra indicate the presence of crystalline Ni (111) and (220) peaks and an average crystallite size of 541 nm. The thermal conductivity of the Ni-P coated substrate results in 14.42 W/mK, whereas bare Al results in 8.03 W/mK. The thermal transient measurement results in an impressive difference in both ΔRth-tot (6.31 K/W, 4.68 K/W) and ΔTj (11.84 °C, 5.82 °C) under different test conditions. It is found that 0.33- μm surface roughness with a 7.5-μm coating thickness potentially improves the thermal behavior of Ni-P substrates, and it is believed that Ni-P is suitable for being used as an alternative coating option for electronic packages.

中文翻译：

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用于热管理应用的 Al5052 基板上的化学镀镍沉积


基于热源的电子封装中的热管理是可靠、持久性能的必要条件，因为必须有效地散发所产生的热量。在这项研究中，提出了一种铝基板上的新型镍磷（Ni-P）合金涂层，以获得改进的热性能，例如导热率（k）、总热阻（Rth-tot）和器件结温（Tj） ）。在不同的沉积时间和测试条件下观察化学镀Ni-P涂层的性能。 Ni-P 涂层的形态在含有 91.2 wt% Ni 和 8.8 wt% P 的基底上形成菜花状生长结构。X 射线衍射光谱表明存在结晶 Ni (111) 和 (220) 峰平均晶粒尺寸为541 nm。 Ni-P 涂层基板的导热系数为 14.42 W/mK，而裸铝基板的导热系数为 8.03 W/mK。在不同测试条件下，热瞬态测量结果显示 ΔRth-tot（6.31 K/W、4.68 K/W）和 ΔTj（11.84 °C、5.82 °C）存在显着差异。研究发现，0.33μm 的表面粗糙度和 7.5μm 的涂层厚度可能会改善 Ni-P 基板的热性能，并且人们相信 Ni-P 适合用作电子封装的替代涂层选项。