In the study reported herein, silver-coated copper (Ag/Cu) powder was modified with alkanethiols featuring alkyl chains of different lengths, namely butyl, octyl, and dodecyl, to improve its thermal stability. The modification of the Ag/Cu powders with adsorbed alkanethiols was confirmed by scanning electron microscopy with energy dispersive spectroscopy, X-ray photoelectron spectroscopy, and thermogravimetric analysis. Each powder was combined with an epoxy resin to prepare an electrically conductive film. The results confirmed that the thermal stability of the films containing alkanethiol-modified Ag/Cu powders is superior to that of the film containing untreated Ag/Cu powder. The longer the alkyl group in the alkanethiol-modified Ag/Cu powder, the higher the initial resistance of the corresponding electrically conductive film and the lower the increase in resistance induced by heat treatment.

中文翻译：

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基于分子自组装的表面改性提高树枝状镀银铜微粒的热稳定性

在本文报道的研究中，用具有不同长度的烷基链（即丁基，辛基和十二烷基）的链烷硫醇修饰了涂银铜（Ag / Cu）粉末，以提高其热稳定性。通过具有能量色散光谱，X射线光电子能谱和热重分析的扫描电子显微镜证实了吸附的链烷硫醇对Ag / Cu粉的改性。将每种粉末与环氧树脂组合以制备导电膜。结果证实，包含链烷硫醇改性的Ag / Cu粉末的膜的热稳定性优于包含未处理的Ag / Cu粉末的膜的热稳定性。烷硫醇改性的Ag / Cu粉末中的烷基越长，