Electronic assemblies are often utilised in environments in which they are exposed to significant combinations of simultaneous vibration and thermal loads. In this study, vibration durability tests and results under isothermal conditions are presented for SAC105 solder joints of CR0805 chip resistor components. The tests are performed using a specially designed multi-cantilever printed wiring assembly (PWA) containing CR0805 components. Harmonic vibration durability tests were conducted at both room and low temperatures, for multiple deflection levels. The resistance of the resistor assemblies was continuously monitored to detect fatigue degradation of the interconnects during the vibration testing. A detailed 3D transient FE analysis is conducted to examine effective solder joint strains as a result of the applied deflections at various temperatures. The measured cycles to failure and calculated strains were used to derive S-N-plots. A comparison of fatigue behaviour at room and low temperature condition is drawn. Failure analysis results are presented to elucidate the failure modes. In addition, the development of Flip Chip specimens is shown including the custom manufacturing of Flip Chip components and first test results.

电子组件通常用于暴露于同时振动和热负荷的显着组合的环境中。在这项研究中，介绍了CR0805片式电阻器组件的SAC105焊点的耐振性测试和等温条件下的结果。使用包含CR0805组件的经过特殊设计的多悬臂印刷布线组件（PWA）进行测试。在室温和低温下都进行了多次偏转水平的谐波振动耐久性测试。连续监测电阻器组件的电阻，以检测振动测试过程中互连的疲劳退化。进行了详细的3D瞬态FE分析，以检查由于在各种温度下施加的挠度而导致的有效焊点应变。测得的故障循环和计算出的应变可用于推导S - N-图。比较了室温和低温条件下的疲劳行为。给出故障分析结果以阐明故障模式。此外，还显示了倒装芯片样品的开发，包括定制的倒装芯片组件制造和首次测试结果。