Traditionally, electromagnetic interference (EMI) shielding material has been occupied by metallic materials due to its high electric conductivity and EMI shielding effect. However, with rising demands from technology development for light-weight, highly durable, and easily moldable materials, metallic materials are gradually being substituted by polymer composite materials. Still, there are limitations on polymer composite as EMI shields: High ratio of fillers in composite achieves excellent EMI shielding effect but it severely compromises its mechanical behaviors. In many studies, they have failed to fabricate the high-ratio filler films with good mechanical durability, but here the initially fragile high-ratio film has been transformed to a flexible film by a very simple method: Hot-pressing. This approach not only solved the problems mentioned above but further provided a possible breakthrough point for composite study by solving threshold of the maximum loading of the fillers in polymer matrix. The stiff composite of polyimide sponge with exceeding carbon black loading became a highly flexible EMI SE film with doubled tensile strength and enhanced EMI SE. As a result, a new way of fabricating flexible EMI shielding polymer composite is demonstrated with great potential applications in aerospace and wireless communications.

传统上，电磁干扰（EMI）屏蔽材料因其高导电性和EMI屏蔽效果而被金属材料所占据。然而，随着技术发展对轻质、高耐用、易成型材料的需求不断增加，金属材料正逐渐被高分子复合材料所取代。尽管如此，聚合物复合材料作为 EMI 屏蔽仍存在局限性：复合材料中高比例的填料可实现出色的 EMI 屏蔽效果，但严重损害了其机械性能。在许多研究中，他们未能制造出具有良好机械耐久性的高比率填料薄膜，但在这里，最初脆弱的高比率薄膜已通过一种非常简单的方法转变为柔性薄膜：热压。该方法不仅解决了上述问题，而且通过解决聚合物基体中填料的最大负载阈值，进一步为复合材料研究提供了可能的突破点。具有超过炭黑负载量的聚酰亚胺海绵的刚性复合材料成为具有两倍抗张强度和增强的 EMI SE 的高度柔韧的 EMI SE 薄膜。因此，展示了一种制造柔性 EMI 屏蔽聚合物复合材料的新方法，在航空航天和无线通信中具有巨大的潜在应用。具有超过炭黑负载量的聚酰亚胺海绵的刚性复合材料成为具有两倍抗张强度和增强的 EMI SE 的高度柔韧的 EMI SE 薄膜。因此，展示了一种制造柔性 EMI 屏蔽聚合物复合材料的新方法，在航空航天和无线通信中具有巨大的潜在应用。具有超过炭黑负载量的聚酰亚胺海绵的刚性复合材料成为具有两倍抗张强度和增强的 EMI SE 的高度柔韧的 EMI SE 薄膜。因此，展示了一种制造柔性 EMI 屏蔽聚合物复合材料的新方法，在航空航天和无线通信中具有巨大的潜在应用。