This study conducts stress-controlled cyclic tension-tension tests from room temperature (RT) to 200 °C, at 50 °C intervals, on high-purity Cu films to comprehensively understand the temperature-dependent fatigue life and the related microstructural and fracture characteristics. As evidenced by the electron backscattering diffraction analysis, the Ʃ3 boundary fraction decreases and the low-angle grain boundary fraction increases as the temperature increases. The significant change in the grain structure at high temperatures leads to a reduced fatigue life. The fatigue striations are closely spaced at RT and the fracture surface develops into the typical fatigue striation and the void zones.

这项研究对高纯度铜膜进行了从室温（RT）到200°C的应力控制的循环拉伸试验，每隔50°C进行一次，以全面了解温度相关的疲劳寿命以及相关的微结构和断裂特性。正如电子背散射衍射分析所证明的，随着温度的升高，fraction3边界分数降低，低角度晶粒边界分数提高。高温下晶粒结构的显着变化导致疲劳寿命降低。疲劳条纹在室温下是紧密间隔的，并且断裂表面发展成典型的疲劳条纹和空隙区域。