In this study, the feasibility of mini-light-emitting diode (LED) RGB display fabricated by a chip-first fan-out panel-level packaging is investigated. Emphasis is placed on the design, materials, process, fabrication, and reliability of the mini-LED RGB display package on a printed circuit board (PCB). The mini-LEDs under consideration and their sizes are red ( 125 ×250 ×100 μm), green ( 130 ×270 ×100 μm), and blue ( 130 ×270 ×100 μm). The spacing among the RGB mini-LEDs is 80 μm, the pixel-to-pixel spacing is also ~ 80 μm, and the pixel pitch is 625 μm. The temporary glass panel for making the redistribution layers (RDLs) of the package is 515 ×510 ×1.1 mm in size. To increase the SMT assembly yield on the PCB, the mini-LEDs are grouped into 4( 2 ×2 pixels)-in-one surface mount device (SMD), that is, a total of 12 R, B, and G mini-LEDs. A PCB ( 132 mm ×77 mm) is designed and fabricated for the drop test of the mini-LED package. Thermal cycling of the mini-LED SMD PCB assembly is also performed by a nonlinear temperature- and time-dependent finite-element simulation.

中文翻译：

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Mini-LED RGB 显示器的扇出面板级封装


在本研究中，研究了通过芯片优先扇出面板级封装制造迷你发光二极管 (LED) RGB 显示器的可行性。重点关注印刷电路板 (PCB) 上的 mini-LED RGB 显示封装的设计、材料、工艺、制造和可靠性。所考虑的 mini-LED 尺寸为红色 (125 ×250 ×100 μm)、绿色 (130 ×270 ×100 μm) 和蓝色 (130 ×270 ×100 μm)。 RGB mini-LED 之间的间距为 80 μm，像素间间距也约为 80 μm，像素间距为 625 μm。用于制作封装再分布层（RDL）的临时玻璃面板尺寸为 515 × 510 × 1.1 mm。为了提高PCB上的SMT组装良率，mini-LED被分为4（2×2像素）合一表面贴装器件（SMD），即总共12个R、B和G mini-LED LED。设计并制作了 PCB（132 mm ×77 mm）用于 mini-LED 封装的跌落测试。 mini-LED SMD PCB 组件的热循环也通过非线性温度和时间相关的有限元模拟来执行。