With the increasing demand for thermal management for high-power electronics devices and modules, a variety of double-sided cooling (DSC) encapsulation modes have emerged. In this article, we focused on the planner packaging structure and solder bump interconnection applied in DSC power modules, thermal management, and thermomechanical reliability were compared based on finite-element method under different power losses, temperatures, and temperature cycling. Results show that planner structure with copper buffer has lower junction temperature versus solder bump interconnection and lower thermal stress of the module is generated. However, chip stress of the planner packaging is high, especially under the same temperature. The planner stretches caused by normal stress is the major factor that affects the thermal stress of chip. With underfilling, reliability of solder bump is improved due to a lower plastic strain and plastic work yet simultaneous increased thermal stress. This study should advance the package of DSC modules.

中文翻译：

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双面冷却功率模块的模片固定结构可靠性研究

随着对大功率电子设备和模块的热管理的需求不断增长，出现了多种双面冷却（DSC）封装模式。在本文中，我们重点研究了在不同功率损耗，温度和温度循环下，基于有限元方法的DSC电源模块中使用的规划器封装结构和焊锡凸点互连，热管理和热机械可靠性。结果表明，具有铜缓冲层的平面结构与焊料凸点互连相比具有较低的结温，并且产生的模块的热应力较低。但是，刨刀包装的切屑应力很高，尤其是在相同温度下。由法向应力引起的刨削器拉伸是影响切屑热应力的主要因素。随着底部填充，由于较低的塑性应变和塑性功，同时增加了热应力，因此提高了焊料凸点的可靠性。这项研究应推进DSC模块的包装。