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Preparation of graphene/copper nanocomposites by ball milling followed by pressureless vacuum sintering
New Carbon Materials ( IF 6.5 ) Pub Date : 2021-05-10 , DOI: 10.1016/s1872-5805(21)60028-8
Zeng-rong Hu , Rui Dai , Di-ni Wang , Xiao-nan Wang , Feng Chen , Xue-liang Fan , Chang-jun Chen , Yi-liang Liao , Qiong Nian

Graphene has been considered as an ideal reinforcement filler for metal matrix composites because of its ultra-high strength and stiffness, and exceptional thermal and electrical properties. Graphene-reinforced copper (Gr/Cu) nanocomposites were fabricated by ball milling followed by pressureless vacuum sintering, and were characterized by SEM, TEM, XRD, Raman spectroscopy and mechanical tests. Results indicate that the graphene platelets are well dispersed in the nanocomposites without apparent damage. The graphene filler dramatically improves the hardness and reduces the coefficient of friction of the Gr/Cu nanocomposites compared to pure Cu.



中文翻译:

球磨然后无压真空烧结制备石墨烯/铜纳米复合材料

石墨烯因其超高的强度和刚度以及出色的热和电性能而被认为是金属基复合材料的理想增强填料。石墨烯增强铜(Gr / Cu)纳米复合材料是通过球磨,然后无压真空烧结制备的,并通过SEM,TEM,XRD,拉曼光谱和机械测试进行了表征。结果表明,石墨烯血小板很好地分散在纳米复合材料中,而没有明显的破坏。与纯Cu相比,石墨烯填料显着提高了硬度并降低了Gr / Cu纳米复合材料的摩擦系数。

更新日期:2021-05-11
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