This letter proposes a novel antenna structure for 60 GHz band 3-D coverage beamforming. By using the proposed antenna structure, the coverage area can be expanded in an elevation plane. Dipole and patch subarray antennas were packaged into one structure by using the copper balls interconnection technique. A simple idea to utilize dipole and patch elements enables endfire and broadside radiations resulting in the coverage area expansion in the elevation plane. Two 2 × 4 array antennas were made up of eight multilayered substrate. Six metal layers were used for each multilayered substrate.

中文翻译：

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60 GHz频段3-D波束成形在高空平面内的波束成形覆盖区域的扩展

这封信提出了一种用于60 GHz频带3-D覆盖波束成形的新型天线结构。通过使用所提出的天线结构，可以在仰角平面上扩展覆盖区域。通过使用铜球互连技术，将偶极子天线和贴片子阵列天线封装为一种结构。利用偶极子和贴片元件的简单想法可实现端射和宽边辐射，从而导致仰角平面中的覆盖区域扩大。两个2×4阵列天线由八个多层基板组成。六个金属层用于每个多层基板。