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Hydrothermal stability of fluorine-induced microporous silica membranes: Effect of steam treatment conditions
AIChE Journal ( IF 3.5 ) Pub Date : 2021-05-04 , DOI: 10.1002/aic.17292 Masakoto Kanezashi 1 , Naoya Hataoka 1 , Rana Ikram 1 , Hiroki Nagasawa 1 , Toshinori Tsuru 1
AIChE Journal ( IF 3.5 ) Pub Date : 2021-05-04 , DOI: 10.1002/aic.17292 Masakoto Kanezashi 1 , Naoya Hataoka 1 , Rana Ikram 1 , Hiroki Nagasawa 1 , Toshinori Tsuru 1
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A fluorine-SiO2 membrane was prepared using triethoxyfluorosilane (TEFS) as a Si precursor, and its hydrothermal stability was evaluated. The TEFS membrane calcined at 750°C had fewer Si-OH and Si-F groups in its network structure and showed H2 permeance that was greater than 10−6 mol m−2 s−1 Pa−1 with H2/N2 and N2/SF6 permeance ratios of 10 and 210, respectively. This membrane performance was relatively stable under the temperature (< 500°C) used for steam treatment, regardless of the steam partial pressure (30, 90 kPa). On the other hand, when the steam treatment temperature was increased beyond 500°C, gas permeance decreased significantly and the membrane became highly selective for He and H2 over smaller molecules (He/N2: > 600, H2/N2: > 100). The relationship between the activation energy of H2 and the permeance ratios (He/H2, He/H2O, H2/H2O) of a TEFS-derived membrane under steam treatment higher than 600°C resulted in a network pore size that approximated in conventional microporous SiO2 membranes.
中文翻译：
氟诱导微孔二氧化硅膜的水热稳定性：蒸汽处理条件的影响
使用三乙氧基氟硅烷 (TEFS) 作为 Si 前驱体制备氟-SiO 2膜，并评估其水热稳定性。在 750°C 下煅烧的 TEFS 膜在其网络结构中具有较少的 Si-OH 和 Si-F 基团，并显示出大于 10 -6 mol m -2 s -1 Pa -1的 H 2 /N 2 的H 2渗透率和 N 2 /SF 6磁导率分别为 10 和 210。这种膜性能在用于蒸汽处理的温度（<500°C）下相对稳定，而与蒸汽分压（30、90 kPa）无关。另一方面，当蒸汽处理温度超过 500°C 时，气体渗透率显着降低，膜对 He 和 H 2 的选择性高于小分子（He/N 2：> 600，H 2 /N 2： > 100）。H 2的活化能与渗透比（He/H 2、He/H 2 O、H 2 /H 2O) 的 TEFS 衍生膜在高于 600°C 的蒸汽处理下产生近似于常规微孔 SiO 2膜的网络孔径。
更新日期：2021-05-04
中文翻译：
氟诱导微孔二氧化硅膜的水热稳定性：蒸汽处理条件的影响
使用三乙氧基氟硅烷 (TEFS) 作为 Si 前驱体制备氟-SiO 2膜，并评估其水热稳定性。在 750°C 下煅烧的 TEFS 膜在其网络结构中具有较少的 Si-OH 和 Si-F 基团，并显示出大于 10 -6 mol m -2 s -1 Pa -1的 H 2 /N 2 的H 2渗透率和 N 2 /SF 6磁导率分别为 10 和 210。这种膜性能在用于蒸汽处理的温度（<500°C）下相对稳定，而与蒸汽分压（30、90 kPa）无关。另一方面，当蒸汽处理温度超过 500°C 时，气体渗透率显着降低，膜对 He 和 H 2 的选择性高于小分子（He/N 2：> 600，H 2 /N 2： > 100）。H 2的活化能与渗透比（He/H 2、He/H 2 O、H 2 /H 2O) 的 TEFS 衍生膜在高于 600°C 的蒸汽处理下产生近似于常规微孔 SiO 2膜的网络孔径。
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