In order to precisely evaluate the contribution of each bonding constituent to the pitting corrosion resistance of transient liquid phase (TLP) bonded 2205 duplex stainless steel (DSS), we have undertaken potentiodynamic polarization (PDP) and microstructural analytic measurements all across the TLP bonded area. The PDP results show that the pitting corrosion resistance of TLP bonded specimens is significantly affected by the presence of certain bonding constituents across the TLP bonded area. Electron microscopy analysis indicates that the formation of complex (Fe,Ni,Cr,Mo)₃P phosphide in the bonding zone (BZ) before the completion of isothermal solidification (IS) as well as the formation of P-rich sigma phase in the diffusion-affected zone (DAZ) following the completion of the IS provides the most preferential sites for the occurrence of pitting corrosion. The PDP results also confirm that the pitting potentials (E_pit) of the TLP bonded specimen before and after IS completion are, respectively, closer to the E_pit of the BZ and the E_pit of the DAZ rather than to those of other TLP BZs.

为了精确评估每种键合成分对瞬态液相（TLP）键合2205双相不锈钢（DSS）耐点蚀性能的贡献，我们在整个TLP键合区域进行了电位动力学极化（PDP）和显微结构分析测量。PDP结果表明，在TLP粘结区域上存在某些粘结成分会极大地影响TLP粘结样品的耐点蚀性。电子显微镜分析表明形成了络合物（Fe，Ni，Cr，Mo）₃等温固化（IS）完成之前在键合区（BZ）中的P磷化物以及IS完成后在扩散影响区（DAZ）中形成富Pσ相提供了最优先的位置点蚀的发生。该PDP结果也证实该点蚀电位（Ë_坑前的TLP接合试验片的），并在完成后分别是更靠近Ë_坑的BZ和Ë_坑的DAZ的，而不是那些其他TLP类药物的。