Directional solidification of Al–Cu–Ti (Al–33wt%Cu–0.1wt%Ti) eutectic alloy was done with a growth rate range (V = 8.58 to 2038.65 µm⋅s⁻¹) at a temperature gradient of 6.45 K⋅mm⁻¹ using Bridgman-type directional solidification furnace. The measurements of thermal conductivity (K) and electrical resistivity (\(\rho\)) for the Al–Cu–Ti alloy solidified with the different values of V were made by the longitudinal heat flow method (LHFM) and DC four-point probe technique (FPPT). While the highest values of K and ρ were determined to be 236.04 W⋅K^–1⋅m^–1 and 5.91 × 10⁻⁸ Ωm, respectively, at 8.58 μm⋅s^–1, the lowest values of K and ρ were obtained to be 199.82 W⋅K^–1⋅m^–1 and 12.11 × 10⁻⁸ Ωm, respectively, at 2038.65 μm⋅s^–1. The K and ρ dependences on V were obtained to be \(K = 259.96\; \times \,V_{{}}^{ - 0.032}\) and \(\rho = 4.47\; \times \;{10}^{{ - {8}}} \, V_{{}}^{0.13}\) from linear regression analysis. The fusion enthalpy (∆H) and specific heat difference between solid and liquid (∆C_P) for the Al–Cu–Ti were also determined to be 222.69 J⋅g^–1 and 0.266 Jg^–1⋅K^–1, respectively, by means of differential scanning calorimetry (DSC).

Al-Cu-Ti（Al-33wt％Cu-0.1wt％Ti）共晶合金的定向凝固是 在6.45K⋅mm的温度梯度下进行的，其生长速率范围为（V = 8.58至2038.65 µm⋅s ^-1）。^-1使用布里奇曼型定向凝固炉。采用纵向热流法（LHFM）和直流四点法对不同V值凝固的Al-Cu-Ti合金的热导率（K）和电阻率（\（\ rho \））进行了测量。探测技术（FPPT）。而最高值ķ和ρ分别确定为236.04W⋅K ^-1 ⋅m ^-1和5.91×10 ^-8Ωm的，分别在8.58μm⋅s ^-1，最低值ķ和ρ得到为199.82W⋅K ^-1 ⋅m ^-1和12.11×10 ^-8 Ωm的，分别在2038.65μm⋅s ^-1。的ķ和ρ上依赖性V得到为\（K = 259.96 \; \倍\，V _ {{}} ^ { - 0.032} \）和\（\ RHO = 4.47 \; \倍\; {10} ^ {{-{8}}} \，V _ {{}} ^ {0.13} \）来自线性回归分析。聚变焓（∆ H）和固体与液体之间的比热差（∆ C _P）为所述Al-Cu-Ti系也确定为222.69J⋅g ^-1和0.266 JG ^-1 ⋅K ^-1分别通过差示扫描量热法（DSC）的装置。