High temperature or temperature nonuniformity has become a serious threat to performance and reliability of high-performance integrated circuits (ICs), which makes the thermal effect turn into a nonignorable issue in the circuit design or the physical design. In order to estimate temperature accurately, the locations of modules have to be determined in advance, which makes an efficient and effective thermal-aware floorplanning play a more important role. Hence, this article proposes a differentiable nonlinear placement model that can optimize temperature and minimize wirelength at the same time without needing to construct a congestion map. In addition, to avoid inducing longer wirelength while optimizing temperature, we propose some techniques, such as thermal-aware clustering, shrink of hot modules, or thermal-force modulation in the multilevel framework. The experimental results demonstrate that temperature and wirelength are greatly improved by our method compared to Corblivar. More importantly, our runtime is quite fast and the fixed-outline constraint can also be satisfied.

中文翻译：

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使用具有热力调制的分析模型的热感知固定轮廓平面布局

高温或温度不均匀性已严重威胁高性能集成电路（IC）的性能和可靠性，这使得热效应在电路设计或物理设计中变成不可忽视的问题。为了准确地估算温度，必须预先确定模块的位置，这使得有效且有效的热感知平面布置扮演着更重要的角色。因此，本文提出了一种可微分的非线性放置模型，该模型可以同时优化温度和最小化导线长度，而无需构造拥塞图。另外，为了避免在优化温度的同时导致更长的线长，我们提出了一些技术，例如热感知群集，热模块收缩，或多级框架中的热力调制。实验结果表明，与Corblivar相比，我们的方法极大地改善了温度和线长。更重要的是，我们的运行时非常快，并且固定轮廓约束也可以得到满足。