Brush plated ZnNi coating is evaluated for replacement of Cd coating during repair of sacrificial coatings on high strength steel components. Plating parameters such as deposition voltage, surface preparation and type of anode for coating deposition are used to study the risk of Internal Hydrogen Embrittlement (IHE). Coating characterization using Transmission Electron Microscopy (TEM) is correlated with Incremental Step Load (ISL) testing, permeation measurements and Thermal Desorption Spectroscopy (TDS) to evaluate the effect of microstructure and crystallographic defects within the coating on the risk of internal hydrogen embrittlement (IHE) of the substrate steel. It is observed that the coating microstructure plays an important role in mitigating IHE. Brush plated ZnNi coatings at 6 V deposition voltage with grit blast method of surface preparation and graphite anode, or deposition at 12 V with scotch-brite™ method of surface preparation and either of platinized Ti or graphite anode can suitably replace Cd coating. Presence of twin boundaries within the coating proved to be beneficial to decrease the risk of IHE by minimizing the H diffusion to the substrate. On the other hand, stacking faults and dislocations within the ZnNi coating do not sufficiently trap hydrogen and therefore do not mitigate the IHE risk when plated at 10 V and 12 V. Coating deposited at 6 V generates low amount of hydrogen, and does not cause IHE irrespective of the microstructure. TDS measurements performed to quantify the hydrogen desorption from different plating conditions indicate a direct correlation between the amount of hydrogen generated during plating and degradation of mechanical strength by IHE cannot always be established, principally because of the influence of microstructure.

评估了在高强度钢部件上的牺牲涂层修复过程中，采用刷镀ZnNi涂层替代Cd涂层的情况。电镀参数（例如沉积电压，表面处理和用于涂层沉积的阳极类型）用于研究内部氢脆（IHE）的风险。使用透射电子显微镜（TEM）进行的涂层表征与逐步载荷（ISL）测试，渗透测量和热脱附光谱（TDS）相关联，以评估涂层中的微观结构和晶体缺陷对内部氢脆风险（IHE）的影响）的基底钢。观察到涂层的微结构在减轻IHE中起着重要的作用。用喷砂处理的表面处理和石墨阳极在6 V的沉积电压下刷镀ZnNi涂层，或者用scotch-brite™表面处理的12 V在电镀电压下用镀铂的Ti或石墨阳极进行刷镀的ZnNi涂层都可以代替Cd涂层。事实证明，涂层中双晶界的存在有利于通过最小化氢向基材的扩散来降低IHE的风险。另一方面，ZnNi涂层内的堆垛层错和位错不能充分俘获氢，因此在以10 V和12 V电镀时不能降低IHE风险。以6 V沉积的涂层产生的氢量很少，并且不会引起IHE与微观结构无关。