A recently developed concept for designing passive microwave components using functional vertical interconnect accesses (vias) for vertical integration in printed circuit boards (PCBs) is extended and transferred to the low temperature cofired ceramic (LTCC) technology. Given the changed material properties and new technology constraints, it is shown how and to what extent the controlled vertical interconnect accesses (via) structures can behave as quasi-transmission lines, thus allowing for another degree of freedom in component design. To demonstrate the validity and utility of functional vias, several novel microwave components are proposed and subsequently analyzed including vertically integrated 2- and 3-way Wilkinson power dividers, as well as vertically integrated 90° and 180° hybrid couplers. Prototypes for the 2-way and 3-way power dividers were manufactured on an LTCC multilayer substrate. Both measurement and full-wave simulation results are in excellent agreement and thus provide a proof of the concept.

中文翻译：

---

使用功能性通孔结构在LTCC多层基板中垂直集成无源微波组件

最近开发的一种设计用于使用功能性垂直互连通道（通孔）在印刷电路板（PCB）中进行垂直集成的无源微波组件的概念得到了扩展，并转移到了低温共烧陶瓷（LTCC）技术中。考虑到不断变化的材料特性和新技术限制，图中显示了受控的垂直互连访问（通过）结构如何以及在何种程度上可以充当准传输线，从而在组件设计中提供了另一个自由度。为了证明功能过孔的有效性和实用性，提出了几种新颖的微波组件，随后对其进行了分析，包括垂直集成的2路和3路Wilkinson功率分配器以及垂直集成的90°和180°混合耦合器。2路和3路功率分配器的原型在LTCC多层基板上制造。测量和全波仿真结果都非常吻合，因此提供了这一概念的证明。