The power delivery requirements for the early microprocessors were fairly rudimentary due to the relatively low power levels. However, several decades of exponential scaling powered by Moore’s law have greatly increased the power requirements and the complexity of the power delivery scheme. The breakdown in Dennard scaling in the mid-2000s has ushered in the multicore era which has increased the number of cores and the power consumption in microprocessors. The steady growth in the power levels and the number of power rails in high-performance microprocessors have increased the power delivery challenges. Integrated voltage regulators (IVRs) have emerged as a key power delivery technology to address these challenges. There are a number of IVR schemes implemented on-die ranging from the simple power gate to fully integrated switching regulators. After covering the fundamentals of power delivery, this article discusses the pros and cons of different types of IVR as well as the technology ingredients required to meet future IVR requirements. This article concludes with a section on advanced packaging technologies that are being developed and needed to enable heterogeneous integration and their impact on power delivery.

中文翻译：

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高性能微处理器的电源传输—挑战，解决方案和未来趋势

由于功率水平相对较低，因此早期微处理器的功率输出要求非常低。但是，由摩尔定律支持的数十年的指数缩放已极大地增加了功率要求和功率传输方案的复杂性。Densard扩展在2000年代中期的崩溃引发了多核时代，该时代增加了内核的数量和微处理器的功耗。高性能微处理器中功率水平的稳定增长和电源轨的数量增加了功率传输的挑战。集成稳压器（IVR）已成为解决这些挑战的关键功率传输技术。片上实现了许多IVR方案，从简单的功率门到完全集成的开关稳压器。在介绍了电源的基本原理之后，本文讨论了不同类型的IVR的利弊，以及满足未来IVR要求所需的技术要素。本文以关于高级封装技术的一节作为结尾，该技术正在开发并需要实现异构集成及其对电源传输的影响。