Glass interposer substrates have attracted growing interest as an alternative to traditional organic and silicon-based interposers for 3-D integrated circuit (IC) and 2.5-D through silicon via (TSV) packages in recent years. However, while glass substrates have the advantages of excellent electrical isolation, superior RF performance, good coefficient of thermal expansion (CTE) adjustability, and the potential for large-scale fabrication, they are inherently brittle. Consequently, an appropriate choice of glass and epoxy molding compound (EMC) material is essential for minimizing the warpage of the molded wafer. To facilitate the package design process, this study, therefore, develops an ANSYS simulation model to predict the warpage of the molded glass wafer given the use of different glass and EMC materials. The validity of the simulation model is confirmed by comparing the numerical results for the warpage of an 8-in molded glass wafer with the experimental measurements obtained using an Advanced Metrology Analysis (aMA) system. Single-factor-analysis experiments are then conducted to examine the effects of five different control factors, namely, the glass substrate thickness, the glass CTE, the glass modulus, the EMC CTE, and the EMC modulus, on the warpage performance of the molded glass wafer. The simulation results provide useful guidelines for the design of robust glass substrate packages.

中文翻译：

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玻璃中介层基板封装翘曲评估的有限元仿真模型

近年来，玻璃中介层基板作为3D集成电路（IC）和2.5D透过硅过孔（TSV）封装的传统有机和硅基中介层的替代品，引起了越来越多的兴趣。但是，尽管玻璃基板具有出色的电绝缘性，出色的RF性能，良好的热膨胀系数（CTE）可调性以及大规模制造的潜力，但它们固有地易碎。因此，玻璃和环氧树脂模制化合物（EMC）材料的适当选择是用于最小化模制晶片的翘曲是必不可少的。因此，为促进封装设计过程，本研究开发了一种ANSYS仿真模型，以预测在使用不同玻璃和EMC材料的情况下模制玻璃晶片的翘曲。通过将8英寸模制玻璃晶圆翘曲的数值结果与使用Advanced Metrology Analysis（aMA）系统获得的实验测量值进行比较，可以确认仿真模型的有效性。然后进行单因素分析实验，以检查五个不同控制因素，即玻璃基板厚度，玻璃CTE，玻璃模量，EMC CTE和EMC模量对成型件翘曲性能的影响。玻璃薄酥饼。仿真结果为设计坚固的玻璃基板封装提供了有用的指导。然后进行单因素分析实验，以检查五个不同控制因素，即玻璃基板厚度，玻璃CTE，玻璃模量，EMC CTE和EMC模量对成型件翘曲性能的影响。玻璃薄酥饼。仿真结果为设计坚固的玻璃基板封装提供了有用的指导。然后进行单因素分析实验，以检查五个不同控制因素，即玻璃基板厚度，玻璃CTE，玻璃模量，EMC CTE和EMC模量对成型件翘曲性能的影响。玻璃薄酥饼。仿真结果为设计坚固的玻璃基板封装提供了有用的指导。